SCHEMBL28093173

SCHEMBL28093173

CP(C)C.c1ccc(Pc2ccccc2)cc1

nearest known ligand 0.39

Predicted protein targets (top 18)

geneUniProtsupporting neighboursconfidence
ESR1 P03372 3/20 0.39
ESR2 Q92731 3/20 0.39
TDP1 Q9NUW8 3/20 0.35
TSHR P16473 3/20 0.35
CA4 P22748 2/20 0.35
ACHE P22303 2/20 0.35
CA12 O43570 1/20 0.35
CA1 P00915 1/20 0.35
CA2 P00918 1/20 0.35
GLA P06280 1/20 0.35
CA3 P07451 1/20 0.35
CA9 Q16790 1/20 0.35
CA14 Q9ULX7 1/20 0.35
LMNA P02545 1/20 0.35
ALOX12 P18054 1/20 0.35
CYP3A4 P08684 1/20 0.33
ALDH1A1 P00352 1/20 0.32
TP53 P04637 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Ethane SCHEMBL28807723 0.87 TSHR (0.39) ESR1ESR2TDP1TSHRCA4
Ethane SCHEMBL372202 0.87 TSHR (0.39) ESR1ESR2TDP1TSHRCA4
Ethane SCHEMBL2219423 0.87 TSHR (0.39) ESR1ESR2TDP1TSHRCA4
Benzene SCHEMBL28943358 0.87 TDP1 (0.44) TDP1TSHRCA4ACHECA12
SCHEMBL49343 0.87 TDP1 (0.44) TDP1TSHRCA4ACHECA12
Benzene SCHEMBL4445625 0.87 TDP1 (0.44) TDP1TSHRCA4ACHECA12
Bromomethane SCHEMBL5706314 0.84 TSHR (0.37) TDP1TSHRCA4ACHECA12
Ethane SCHEMBL4318566 0.84 TSHR (0.37) TDP1TSHRCA4ACHECA12
SCHEMBL270356 0.84 ESR1 (0.60) ESR1ESR2TDP1CYP3A4
SCHEMBL10655664 0.84 ESR1 (0.43) ESR1ESR2TDP1CYP3A4

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 5 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-106715580-B Resin composition for semiconductor encapsulation, semiconductor device, and structure 住友电木株式会社 2019-11-26 CN disclosed
CN-109153858-A Thermosetting resin composition for LDS, resin molded article, and three-dimensional molded circuit element 住友电木株式会社 2019-01-04 CN disclosed
CN-107793553-A Composition epoxy resin and semiconductor device 住友电木株式会社 2018-03-13 CN disclosed
CN-106715580-A Resin composition for semiconductor encapsulation, semiconductor device, and structure 住友电木株式会社 2017-05-24 CN disclosed
CN-105968324-A Resin composition for encapsulation, method for manufacturing electronic component and electronic component 住友电木株式会社 2016-09-28 CN disclosed