Predicted protein targets (top 6)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | TP53 | P04637 | 1/20 | 0.32 |
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.32 |
| ▸ | TSHR | P16473 | 1/20 | 0.32 |
| ▸ | PTGS1 | P23219 | 1/20 | 0.30 |
| ▸ | TET2 | Q6N021 | 1/20 | 0.30 |
| ▸ | AKR1C3 | P42330 | 1/20 | 0.30 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL27695407 | 0.91 | TP53 (0.32) | TP53ALDH1A1TSHRPTGS1TET2 | |
| SCHEMBL27900650 | 0.83 | ALDH1A1 (0.40) | ALDH1A1TSHRPTGS1TET2AKR1C3 | |
| SCHEMBL27614993 | 0.83 | TP53 (0.40) | TP53PTGS1AKR1C3 | |
| SCHEMBL27589561 | 0.81 | PTGS1 (0.32) | ALDH1A1PTGS1AKR1C3 | |
| SCHEMBL9418229 | 0.81 | PTGS1 (0.32) | PTGS1AKR1C3 | |
| SCHEMBL28002167 | 0.80 | TP53 (0.38) | TP53PTGS1AKR1C3 | |
| SCHEMBL11666425 | 0.80 | PTGS1 (0.37) | ALDH1A1TSHRPTGS1AKR1C3 | |
| SCHEMBL27514808 | 0.79 | PTGS1 (0.31) | PTGS1AKR1C3 | |
| SCHEMBL871351 | 0.77 | FFAR3 (0.43) | ALDH1A1TSHRPTGS1AKR1C3 | |
| SCHEMBL15042 | 0.77 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-110521290-A | Photosensitive resin composition, dry film using same, printed wiring board, and method for producing printed wiring board | HITACHI CHEMICAL CO LTD | 2019-11-29 | — | — | CN | disclosed |
| CN-107922522-A | COMPOSITE MATERIAL, PHOTOSENSITIVE RESIN COMPOSITION FOR SOLDER RESIST, AND PHOTOSENSITIVE ELEMENT | 日立化成株式会社 | 2018-04-17 | — | — | CN | disclosed |
| CN-107003606-A | Solder mask composition and the printed substrate through covering | 互应化学工业株式会社 | 2017-08-01 | — | — | CN | disclosed |
| CN-104204869-B | Molding material for lamp reflector and molded article | 日本复合材料株式会社 | 2016-09-07 | — | — | CN | disclosed |