⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL28714597 | 0.90 | — | — | |
| SCHEMBL21175575 | 0.89 | — | — | |
| SCHEMBL11799751 | 0.88 | — | — | |
| SCHEMBL15011701 | 0.87 | — | — | |
| SCHEMBL4105622 | 0.86 | — | — | |
| SCHEMBL15011404 | 0.84 | — | — | |
| SCHEMBL9064168 | 0.84 | — | — | |
| SCHEMBL7902096 | 0.83 | — | — | |
| SCHEMBL1109764 | 0.83 | CA2 (0.31) | — | |
| SCHEMBL93963 | 0.81 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-109689818-A | Pressurize adhesion type adhesive member | 日东电工株式会社 | 2019-04-26 | — | — | CN | disclosed |
| CN-109661444-A | Pressurize adhesion type adhesive member | 日东电工株式会社 | 2019-04-19 | — | — | CN | disclosed |
| CN-104114660-B | Adhesive composition and bonding sheet | 日东电工株式会社 | 2016-10-19 | — | — | CN | disclosed |