Urea

Urea

SCHEMBL28099509

NC(=O)NNS(=O)(=O)c1ccccc1.NC(N)=O

nearest known ligand 0.65

Full drug profile on Sugi Atlas →

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
BCAT1 P54687 2/20 0.65
KAT6A Q92794 6/20 0.62
GAA P10253 6/20 0.59
MEN1 O00255 1/20 0.57
KMT2A Q03164 1/20 0.57
HTT P42858 2/20 0.56
SMN1; SMN2 Q16637 2/20 0.56
CA1 P00915 2/20 0.54
CA2 P00918 2/20 0.54
CA12 O43570 1/20 0.54
CA9 Q16790 1/20 0.54
PKM P14618 1/20 0.50
CYP3A4 P08684 1/20 0.50
LMNA P02545 1/20 0.50
TDP1 Q9NUW8 1/20 0.50
MMP1 P03956 1/20 0.50
MMP2 P08253 1/20 0.50
MMP9 P14780 1/20 0.50
MMP8 P22894 1/20 0.50
MMP13 P45452 1/20 0.50

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2361900 0.98 BCAT1 (0.67) BCAT1KAT6AGAAMEN1KMT2A
Bicarbonate SCHEMBL28070496 0.94 BCAT1 (0.62) BCAT1KAT6AGAAMEN1KMT2A
SCHEMBL8395741 0.82 KMT2A (0.54) BCAT1KAT6AGAAMEN1KMT2A
SCHEMBL11532705 0.82 BCAT1 (0.71) BCAT1KAT6AGAAMEN1KMT2A
SCHEMBL8010000 0.81 BCAT1 (0.59) BCAT1KAT6AGAAMEN1KMT2A
Sulfhydryl Boron Hydride SCHEMBL11663199 0.81 GAA (0.63) BCAT1KAT6AGAAMEN1KMT2A
Hydrochloric Acid SCHEMBL8024340 0.79 BCAT1 (0.58) BCAT1KAT6AGAAMEN1KMT2A
SCHEMBL9063965 0.79 BCAT1 (0.62) BCAT1KAT6AGAAMEN1KMT2A
SCHEMBL7627545 0.79 BCAT1 (0.62) BCAT1KAT6AGAAMEN1KMT2A
Sulfhydryl Boron Hydride SCHEMBL11784999 0.79 GAA (0.61) BCAT1KAT6AGAAMEN1KMT2A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-105874583-A Electronic component device production method and electronic component sealing sheet 日东电工株式会社 2016-08-17 CN disclosed