Dimethylamine

Dimethylamine

SCHEMBL28113523

CNC.Nc1cccc(N)c1

nearest known ligand 0.75

Full drug profile on Sugi Atlas →

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
CYP3A4 P08684 3/20 0.75
CASP1 P29466 2/20 0.75
RECQL P46063 1/20 0.75
ALDH1A1 P00352 6/20 0.50
TDP1 Q9NUW8 2/20 0.50
CA12 O43570 1/20 0.50
CA1 P00915 1/20 0.50
CA2 P00918 1/20 0.50
CA7 P43166 1/20 0.50
CA9 Q16790 1/20 0.50
CA14 Q9ULX7 1/20 0.50
KDM4E B2RXH2 3/20 0.48
MEN1 O00255 2/20 0.48
MAPT P10636 2/20 0.48
KMT2A Q03164 2/20 0.48
LMNA P02545 2/20 0.48
GAA P10253 1/20 0.48
GFER P55789 1/20 0.48
MAOA P21397 3/20 0.48
MAP4K4 O95819 1/20 0.47

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Ethane SCHEMBL21408539 0.87 CYP3A4 (0.86) CYP3A4CASP1RECQLALDH1A1TDP1
SCHEMBL11661863 0.87 CYP3A4 (1.00) CYP3A4CASP1RECQLALDH1A1TDP1
SCHEMBL1934399 0.87 CYP3A4 (1.00) CYP3A4CASP1RECQLALDH1A1TDP1
SCHEMBL16054 0.87
Fluoromethane SCHEMBL28151664 0.84 CYP3A4 (0.80) CYP3A4CASP1RECQLALDH1A1TDP1
SCHEMBL28299291 0.84 CYP3A4 (0.80) CYP3A4CASP1RECQLALDH1A1TDP1
Methyl Alcohol SCHEMBL27727278 0.84 CYP3A4 (0.80) CYP3A4CASP1RECQLALDH1A1TDP1
Dimethylamine SCHEMBL8475782 0.84 ACHE (0.60) CYP3A4CASP1RECQLALDH1A1TDP1
Fluoride SCHEMBL25262419 0.83 CYP3A4 (0.92) CYP3A4CASP1RECQLALDH1A1TDP1
Ammonia Solution, Strong SCHEMBL7646715 0.83

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-106496950-A Low-smoke flame-retardant epoxy resin composition 惠柏新材料科技(上海)股份有限公司 2017-03-15 CN disclosed
CN-104204084-B Hardening resin composition and manufacture method, highly thermal-conductive resin composition and high-termal conductivity multilayer board 株式会社德山 2016-11-16 CN disclosed