Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | CA12 | O43570 | 3/20 | 0.50 |
| ▸ | CA2 | P00918 | 3/20 | 0.50 |
| ▸ | CA9 | Q16790 | 3/20 | 0.50 |
| ▸ | CA1 | P00915 | 2/20 | 0.50 |
| ▸ | CA14 | Q9ULX7 | 2/20 | 0.50 |
| ▸ | GLA | P06280 | 1/20 | 0.50 |
| ▸ | CA3 | P07451 | 1/20 | 0.50 |
| ▸ | CA4 | P22748 | 1/20 | 0.50 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.50 |
| ▸ | MMP3 | P08254 | 1/20 | 0.37 |
| ▸ | BCL2L1 | Q07817 | 1/20 | 0.37 |
| ▸ | ESR1 | P03372 | 12/20 | 0.35 |
| ▸ | ESR2 | Q92731 | 10/20 | 0.35 |
| ▸ | ALDH1A1 | P00352 | 2/20 | 0.35 |
| ▸ | CYP3A4 | P08684 | 2/20 | 0.35 |
| ▸ | LTA4H | P09960 | 1/20 | 0.33 |
| ▸ | NR1H2 | P55055 | 1/20 | 0.33 |
| ▸ | BAX | Q07812 | 1/20 | 0.33 |
| ▸ | MEN1 | O00255 | 1/20 | 0.33 |
| ▸ | NPC1 | O15118 | 1/20 | 0.33 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Phenol SCHEMBL28157129 | 1.00 | CA12 (0.50) | CA12CA2CA9CA1CA14 | |
| Phenol SCHEMBL28189875 | 1.00 | CA12 (0.50) | CA12CA2CA9CA1CA14 | |
| Phenol SCHEMBL27305009 | 1.00 | CA12 (0.50) | CA12CA2CA9CA1CA14 | |
| Phenol SCHEMBL28190486 | 0.98 | CA12 (0.48) | CA12CA2CA9CA1CA14 | |
| Phenol SCHEMBL27622719 | 0.94 | CA12 (0.44) | CA12CA2CA9CA1CA14 | |
| Biphenyl SCHEMBL28248213 | 0.94 | MMP3 (0.48) | CA12CA2CA9CA1CA14 | |
| Phenol SCHEMBL28189876 | 0.92 | CA12 (0.42) | CA12CA2CA9CA1CA14 | |
| Phenol SCHEMBL28113275 | 0.90 | CA12 (0.41) | CA12CA2CA9CA1CA14 | |
| Phenol SCHEMBL28153391 | 0.90 | CA12 (0.41) | CA12CA2CA9CA1CA14 | |
| Phenol SCHEMBL27799084 | 0.90 | CA12 (0.41) | CA12CA2CA9CA1CA14 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 9 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-105408418-B | Thermosetting resin composition for semiconductor package, and prepreg and metal clad laminate using the same | 株式会社LG化学 | 2017-04-26 | — | — | CN | claimed |
| CN-104883828-B | The manufacturing method of printed wiring board | 味之素株式会社 | 2019-04-16 | — | — | CN | disclosed |
| CN-109233212-A | Resin combination | 味之素株式会社 | 2019-01-18 | — | — | CN | disclosed |
| CN-108864654-A | Resin composition layer | 味之素株式会社 | 2018-11-23 | — | — | CN | disclosed |
| CN-108864653-A | Resin combination | 味之素株式会社 | 2018-11-23 | — | — | CN | disclosed |
| CN-108884302-A | Heat-curing resin constituent, prepreg and their solidfied material | 日本化药株式会社 | 2018-11-23 | — | — | CN | disclosed |
| CN-107722623-A | Resin combination | 味之素株式会社 | 2018-02-23 | — | — | CN | disclosed |
| CN-104903332-B | The application of the preparation method of epoxide, the compound containing alkoxysilyl, the composition comprising the compound, the cured product prepared by said composition and said composition | 韩国生产技术研究院 | 2017-12-19 | — | — | CN | disclosed |
| CN-105408418-B | Thermosetting resin composition for semiconductor package, and prepreg and metal clad laminate using the same | 株式会社LG化学 | 2017-04-26 | — | — | CN | disclosed |