Predicted protein targets (top 9)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | LPAR3 | Q9UBY5 | 13/20 | 0.71 |
| ▸ | LPAR2 | Q9HBW0 | 10/20 | 0.71 |
| ▸ | LPAR1 | Q92633 | 8/20 | 0.71 |
| ▸ | CDC25A | P30304 | 1/20 | 0.47 |
| ▸ | LPAR5 | Q9H1C0 | 2/20 | 0.46 |
| ▸ | ENPP2 | Q13822 | 2/20 | 0.43 |
| ▸ | LPAR6 | P43657 | 1/20 | 0.43 |
| ▸ | LPAR4 | Q99677 | 1/20 | 0.43 |
| ▸ | CYP3A4 | P08684 | 1/20 | 0.42 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Tetrahydrofuran SCHEMBL27900225 | 0.98 | LPAR3 (0.75) | LPAR3LPAR2LPAR1CDC25ALPAR5 | |
| Tetrahydrofuran SCHEMBL28299623 | 0.98 | LPAR3 (0.75) | LPAR3LPAR2LPAR1CDC25ALPAR5 | |
| SCHEMBL7557287 | 0.94 | LPAR3 (0.74) | LPAR3LPAR2LPAR1CDC25ALPAR5 | |
| Phosphoric Acid Monododecyl Ester SCHEMBL2049086 | 0.91 | LPAR3 (0.81) | LPAR3LPAR2LPAR1CDC25ALPAR5 | |
| Oxirane SCHEMBL7164231 | 0.91 | LPAR3 (0.81) | LPAR3LPAR2LPAR1CDC25ALPAR5 | |
| SCHEMBL2788530 | 0.89 | LPAR3 (0.77) | LPAR3LPAR2LPAR1CDC25ALPAR5 | |
| Hexadecyl Dihydrogen Phosphate SCHEMBL10533860 | 0.86 | LPAR3 (0.88) | LPAR3LPAR2LPAR1LPAR5CYP3A4 | |
| Phosphoric Acid Monododecyl Ester SCHEMBL27793114 | 0.86 | LPAR3 (0.95) | LPAR3LPAR2LPAR1LPAR5CYP3A4 | |
| Fluoride SCHEMBL28218528 | 0.86 | LPAR3 (0.95) | LPAR3LPAR2LPAR1LPAR5CYP3A4 | |
| Phosphoric Acid Monodecyl Ester SCHEMBL27465279 | 0.86 | LPAR3 (0.95) | LPAR3LPAR2LPAR1LPAR5CYP3A4 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-109643662-A | Chip bonds cream and semiconductor device | 住友电木株式会社 | 2019-04-16 | — | — | CN | disclosed |
| CN-107849432-A | Heat conductivity composition, semiconductor device, the adhesive bonding method of the manufacture method of semiconductor device and heat sink | 住友电木株式会社 | 2018-03-27 | — | — | CN | disclosed |
| CN-107207941-A | Paste adhesive composition, semiconductor device, method for manufacturing semiconductor device, and method for bonding heat-dissipating plate | 住友电木株式会社 | 2017-09-26 | — | — | CN | disclosed |