SCHEMBL28183752

SCHEMBL28183752

CN(C)CCC(Cc1ccc(CN)cc1)C(=O)c1ccc(N2CCOCC2)cc1

nearest known ligand 0.41

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
AOC3 Q16853 4/20 0.41
ACACB O00763 1/20 0.41
GSK3B P49841 1/20 0.41
MAPT P10636 8/20 0.40
SMN1; SMN2 Q16637 4/20 0.40
LMNA P02545 3/20 0.40
L3MBTL1 Q9Y468 1/20 0.40
HIF1A Q16665 2/20 0.39
ALDH1A1 P00352 7/20 0.38
MAPK1 P28482 2/20 0.38
TDP1 Q9NUW8 1/20 0.38
RAB9A P51151 4/20 0.37
HTT P42858 2/20 0.37
NPC1 O15118 2/20 0.37
TP53 P04637 2/20 0.37
ATM Q13315 2/20 0.37
HPGD P15428 1/20 0.37
PKM P14618 1/20 0.37
MEN1 O00255 1/20 0.36
KMT2A Q03164 1/20 0.36

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL11033548 0.90 NPC1 (0.47) ACACBGSK3BMAPTSMN1; SMN2LMNA
SCHEMBL2294354 0.89 MAPT (0.46) AOC3GSK3BMAPTSMN1; SMN2LMNA
SCHEMBL28110430 0.85 MAPT (0.46) AOC3ACACBGSK3BMAPTSMN1; SMN2
SCHEMBL28267325 0.83 POLB (0.45) AOC3ACACBGSK3BMAPTSMN1; SMN2
SCHEMBL27771175 0.83 MAPT (0.45) AOC3GSK3BMAPTSMN1; SMN2LMNA
SCHEMBL28154802 0.82 AOC3 (0.40) AOC3ACACBMAPTSMN1; SMN2L3MBTL1
SCHEMBL28927708 0.79 MAPT (0.51) ACACBGSK3BMAPTSMN1; SMN2LMNA
SCHEMBL27923385 0.78 MAPT (0.48) AOC3GSK3BMAPTSMN1; SMN2LMNA
SCHEMBL27942631 0.77 MAPT (0.49) ACACBGSK3BMAPTSMN1; SMN2LMNA
SCHEMBL30670623 0.76 MAPT (0.57) ACACBGSK3BMAPTSMN1; SMN2LMNA

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 19 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-110531582-A Hardening resin composition and application thereof NIPPON CATALYTIC CHEM IND 2019-12-03 CN disclosed
CN-105182687-B Non- roasting conductive resin composition and conducting channel 太阳油墨制造株式会社 2019-11-15 CN disclosed
CN-105093828-B Hardening resin composition, dry film and printed circuit board 太阳油墨制造株式会社 2019-11-05 CN disclosed
CN-103576457-B Curable resin composition and use thereof 株式会社日本触媒 2019-10-25 CN disclosed
CN-110268021-A Coloured composition, the filter substrate and display device for having used the coloured composition 东丽株式会社 2019-09-20 CN disclosed
CN-104641294-B Negative light-sensitive resin combination 日产化学工业株式会社 2019-08-23 CN disclosed
CN-110114702-A Colour filter color material dispersion liquid, colour filter colored resin composition, colour filter and display equipment DNP精细化工股份有限公司 2019-08-09 CN disclosed
CN-104350421-B Photosensitive composite and printed circuit board with its cured layer 太阳油墨制造株式会社 2019-06-04 CN disclosed
CN-105415883-B Ink jet recording method and printed article 富士胶片株式会社 2019-04-23 CN disclosed
CN-105348917-B Radiation-curing type ink composition for ink jet, record object and ink jet recording method 精工爱普生株式会社 2019-01-08 CN disclosed
CN-108780273-A Photosensitive color resin combination, colour filter and its manufacturing method and display equipment DNP精细化工股份有限公司 2018-11-09 CN disclosed
CN-108373657-A Light-cured type composition for ink jet recording, ink jet recording method 精工爱普生株式会社 2018-08-07 CN disclosed
CN-103163733-B Hardening resin composition and application thereof 株式会社日本触媒 2018-08-07 CN disclosed
CN-108291027-A Modified polyimide and curable resin composition 株式会社LG化学 2018-07-17 CN disclosed
CN-105273498-B Light curable type ink composition, recording method and device, light-cured type composition for ink jet recording and ink jet recording method 精工爱普生株式会社 2018-06-15 CN disclosed
CN-108148468-A Light-cured type composition for ink jet recording, ink jet recording method 精工爱普生株式会社 2018-06-12 CN disclosed
CN-102863847-B Photocurable ink composition for inkjet recording and inkjet recording method 精工爱普生株式会社 2018-03-09 CN disclosed
CN-105074804-B resin black matrix substrate and touch panel 东丽株式会社 2018-02-13 CN disclosed
CN-107429064-A Resin composition for electric/electronic component 迈图高新材料日本合同公司 2017-12-01 CN disclosed