Predicted protein targets (top 7)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | FAAH | O00519 | 5/20 | 0.35 |
| ▸ | CNR1 | P21554 | 1/20 | 0.35 |
| ▸ | CNR2 | P34972 | 1/20 | 0.35 |
| ▸ | TSHR | P16473 | 4/20 | 0.33 |
| ▸ | HPGD | P15428 | 1/20 | 0.33 |
| ▸ | ALDH1A1 | P00352 | 2/20 | 0.32 |
| ▸ | CYP3A4 | P08684 | 1/20 | 0.32 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL21625001 | 0.99 | TSHR (0.34) | FAAHCNR1CNR2TSHRHPGD | |
| SCHEMBL21360070 | 0.94 | TSHR (0.35) | FAAHCNR1CNR2TSHRHPGD | |
| SCHEMBL1132650 | 0.88 | TSHR (0.37) | TSHRHPGDALDH1A1CYP3A4 | |
| SCHEMBL21360138 | 0.86 | TSHR (0.33) | FAAHCNR1CNR2TSHRHPGD | |
| SCHEMBL28040196 | 0.84 | TSHR (0.34) | TSHRHPGDALDH1A1CYP3A4 | |
| SCHEMBL21357993 | 0.84 | TSHR (0.36) | FAAHCNR1CNR2TSHRHPGD | |
| SCHEMBL6557557 | 0.83 | TSHR (0.45) | FAAHCNR1CNR2TSHRHPGD | |
| SCHEMBL19456974 | 0.83 | TSHR (0.45) | FAAHCNR1CNR2TSHRHPGD | |
| SCHEMBL21360009 | 0.81 | TSHR (0.34) | FAAHCNR1CNR2TSHRHPGD | |
| SCHEMBL29161397 | 0.81 | TSHR (0.36) | FAAHCNR1CNR2TSHRHPGD |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-103571403-B | Adhesive, adhesive phase and bonding sheet | 日东电工株式会社 | 2018-05-11 | — | — | CN | disclosed |
| CN-103571404-B | Radiation curing adhesive, radiation-curable adhesive layer, radiation curable bonding sheet and layered product | 日东电工株式会社 | 2018-03-16 | — | — | CN | disclosed |