SCHEMBL21360009

SCHEMBL21360009

C=CC(=O)OC(C)CCC[Si](C)(OCC)OCC

nearest known ligand 0.34

Predicted protein targets (top 11)

geneUniProtsupporting neighboursconfidence
TSHR P16473 3/20 0.34
HPGD P15428 1/20 0.33
FAAH O00519 5/20 0.31
ALDH1A1 P00352 1/20 0.30
TP53 P04637 1/20 0.30
CYP3A4 P08684 1/20 0.30
MAPK1 P28482 1/20 0.30
SMN1; SMN2 Q16637 1/20 0.30
HIF1A Q16665 1/20 0.30
CNR1 P21554 1/20 0.30
CNR2 P34972 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL21360138 0.96 TSHR (0.33) TSHRHPGDFAAHCNR1CNR2
SCHEMBL2796852 0.91 TSHR (0.36) TSHRHPGDALDH1A1TP53CYP3A4
SCHEMBL21360070 0.87 TSHR (0.35) TSHRHPGDFAAHALDH1A1TP53
SCHEMBL21359809 0.85 TSHR (0.36) TSHRHPGDALDH1A1CYP3A4
SCHEMBL29161447 0.83 TSHR (0.37) TSHRHPGDALDH1A1CYP3A4
SCHEMBL5605420 0.83 TSHR (0.39) TSHRHPGDALDH1A1TP53CYP3A4
SCHEMBL21625001 0.82 TSHR (0.34) TSHRHPGDFAAHALDH1A1TP53
SCHEMBL10429553 0.82 TSHR (0.36) TSHRHPGDALDH1A1TP53CYP3A4
SCHEMBL28205294 0.81 FAAH (0.35) TSHRHPGDFAAHALDH1A1CYP3A4
SCHEMBL21359746 0.81 TSHR (0.35) TSHRHPGDFAAHALDH1A1CYP3A4

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 7 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-115003759-B Resin composition, method for producing same, and multicomponent curable resin composition 株式会社钟化 2023-12-01 CN disclosed
CN-117136204-A Polysiloxane resin and use thereof 株式会社钟化 2023-11-28 CN disclosed
CN-116917368-A Curable resin composition and use thereof 株式会社钟化 2023-10-20 CN disclosed
CN-114008113-B Resin composition, method for producing same, and multicomponent curable resin composition 株式会社钟化 2023-05-02 CN disclosed
WO-2019177013-A9 HOLLOW-PARTICLE DISPERSION 積水化成品工業株式会社 (JP) 2019-11-14 WO disclosed
WO-2019177013-A1 HOLLOW-PARTICLE DISPERSION 積水化成品工業株式会社 2019-09-19 WO disclosed
WO-2019177006-A1 HOLLOW PARTICLES, METHOD FOR PRODUCING SAME, AND USAGE OF SAME 積水化成品工業株式会社 2019-09-19 WO disclosed