SCHEMBL28230275

SCHEMBL28230275

CC(C)(C)c1ccc(-c2ccc(-c3ccccc3)cc2)c(C(C)(C)C)c1.OP(O)OP(O)O

nearest known ligand 0.41

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
RXRA P19793 1/20 0.40
RXRB P28702 1/20 0.40
NPC1 O15118 1/20 0.38
ALDH1A1 P00352 1/20 0.38
PLA2G1B P04054 1/20 0.38
NFKB1 P19838 1/20 0.38
CASP3 P42574 1/20 0.38
RAB9A P51151 1/20 0.38
NFKB2 Q00653 1/20 0.38
RELA Q04206 1/20 0.38
SENP8 Q96LD8 1/20 0.38
SENP7 Q9BQF6 1/20 0.38
SENP6 Q9GZR1 1/20 0.38
L3MBTL1 Q9Y468 1/20 0.38
ATG4B Q9Y4P1 1/20 0.38
CYP2C9 P11712 2/20 0.37
BACE1 P56817 1/20 0.36
GPR84 Q9NQS5 1/20 0.35
HSD17B2 P37059 1/20 0.35
EGFR P00533 2/20 0.35

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL29545640 0.92 RXRA (0.43) RXRARXRBNPC1ALDH1A1PLA2G1B
SCHEMBL30222313 0.92 RXRA (0.43) RXRARXRBNPC1ALDH1A1PLA2G1B
SCHEMBL30262470 0.92 RXRA (0.41) RXRARXRBNPC1ALDH1A1PLA2G1B
SCHEMBL31099232 0.90 NPC1 (0.41) RXRARXRBNPC1ALDH1A1PLA2G1B
SCHEMBL30524348 0.89 NPC1 (0.46) RXRARXRBNPC1ALDH1A1PLA2G1B
SCHEMBL7067289 0.89 NPC1 (0.46) RXRARXRBNPC1ALDH1A1PLA2G1B
SCHEMBL29394789 0.86 RXRA (0.43) RXRARXRBNPC1ALDH1A1PLA2G1B
SCHEMBL29397957 0.84 RXRA (0.39) RXRARXRBNPC1ALDH1A1PLA2G1B
Phosphoric Acid SCHEMBL17222202 0.84 PTPN5 (0.46) RXRARXRBNPC1ALDH1A1PLA2G1B
Hypophosphorous Acid SCHEMBL30634526 0.84 RXRA (0.44) RXRARXRBNPC1ALDH1A1PLA2G1B

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 26 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-120118499-A Polycarbonate alloy with laser direct structuring characteristic and preparation method thereof 广东中塑新材料股份有限公司 2025-06-10 CN claimed
CN-114940802-B Homopolymerized POM composition with good thermal stability and low mold deposit and preparation method thereof 金发科技股份有限公司 2024-03-22 CN claimed
CN-117624481-A Polypropylene with high melt strength and high crystallinity and preparation method thereof 山东高端化工研究院有限公司 2024-03-01 CN claimed
CN-112480643-B Low-temperature-resistant nylon composite material and preparation method thereof 江阴市一诺工程塑料有限公司 2023-03-14 CN claimed
CN-110945066-B Halogen-free sulfonate and/or sulfinate esters as flame retardants, flame retardant synergists and free radical generators in plastics 弗劳恩霍弗应用研究促进协会 2022-10-14 CN claimed
CN-110655792-B Low-dielectric-laser direct-forming composite material suitable for 5G communication and preparation method thereof 中广核高新核材科技(苏州)有限公司 2022-06-14 CN claimed
CN-120192674-A Water-based liquid laser ink and preparation method thereof 广州合胜高新材料有限公司 2025-06-24 CN disclosed
CN-120118499-A Polycarbonate alloy with laser direct structuring characteristic and preparation method thereof 广东中塑新材料股份有限公司 2025-06-10 CN disclosed
CN-120129722-A Composition containing thermoplastic resin or thermoplastic elastomer 东洋纺艾睦希株式会社 2025-06-10 CN disclosed
CN-119213074-A Polybutylene terephthalate composition for high frequency radio wave applications 沙特基础工业公司(SABIC)全球技术有限公司 2024-12-27 CN disclosed
CN-114940802-B Homopolymerized POM composition with good thermal stability and low mold deposit and preparation method thereof 金发科技股份有限公司 2024-03-22 CN disclosed
CN-113348205-B Method for stabilizing halogen-free thermoplastic recyclates, plastic compositions, stabilizer compositions and use of stabilizer compositions 弗劳恩霍夫应用研究促进协会 2024-02-27 CN disclosed
CN-112601776-B Polyamide and polyamide composition 株式会社可乐丽 2024-01-02 CN disclosed
CN-115536992-A Polyester resin composition, polyester film and flexible flat cable SKC株式会社 2022-12-30 CN disclosed
CN-110291128-B Molding material, resin molded body, cosmetic container, semiconductor container, and method for producing semiconductor container 日本瑞翁株式会社 2022-12-02 CN disclosed
CN-114456609-A High-grade highway anti-aging heavy traffic asphalt and preparation method thereof 南通通沙沥青科技有限公司 2022-05-10 CN disclosed
CN-110325590-B Resin composition and resin molded article 日本瑞翁株式会社 2022-04-12 CN disclosed
CN-107236294-B Preparation method of polyamide 66 powder material for selective laser sintering 湖南华曙高科技股份有限公司 2022-03-29 CN disclosed
CN-114132039-A Degradable temperature-sensitive color-changing two-way stretching polylactic acid film and preparation method thereof 厦门长塑实业有限公司 2022-03-04 CN disclosed
CN-108368284-A Heat-swellable foam for low-temperature setting SIKA技术股份公司 2018-08-03 CN disclosed