SCHEMBL28239404

SCHEMBL28239404

O=C(CCCC(=O)ONCc1ccccc1)ONCc1ccccc1

nearest known ligand 0.55

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
GAA P10253 1/20 0.55
STING1 Q86WV6 1/20 0.49
MEN1 O00255 1/20 0.49
KMT2A Q03164 1/20 0.49
EPHX2 P34913 2/20 0.46
PPID Q08752 1/20 0.44
EPHX1 P07099 1/20 0.43
SMN1; SMN2 Q16637 1/20 0.43
TDP1 Q9NUW8 1/20 0.43
HDAC3 O15379 1/20 0.42
HDAC1 Q13547 1/20 0.42
HDAC2 Q92769 1/20 0.42
HDAC8 Q9BY41 1/20 0.42
NCOR2 Q9Y618 1/20 0.42
TSHR P16473 1/20 0.42
RECQL P46063 1/20 0.42
TP53 P04637 1/20 0.42
THRB P10828 1/20 0.42
IDO1 P14902 1/20 0.42
CYP2C19 P33261 1/20 0.42

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL15656106 0.96 MEN1 (0.53) GAASTING1MEN1KMT2AEPHX2
SCHEMBL21611670 0.92 STING1 (0.54) GAASTING1MEN1KMT2AEPHX2
SCHEMBL8905338 0.90 EPHX2 (0.56) STING1MEN1KMT2AEPHX2PPID
SCHEMBL3959551 0.87 TDP1 (0.59) STING1KMT2AEPHX2EPHX1TDP1
SCHEMBL26699105 0.87 STING1 (0.48) GAASTING1MEN1KMT2AEPHX2
SCHEMBL8842303 0.87 MEN1 (0.49) GAASTING1MEN1KMT2AEPHX2
SCHEMBL27475441 0.87 STING1 (0.44) GAASTING1MEN1KMT2AEPHX2
Hydrochloric Acid SCHEMBL8843485 0.86 MEN1 (0.47) GAASTING1MEN1KMT2AEPHX2
SCHEMBL8843852 0.86 STING1 (0.43) GAASTING1MEN1KMT2AEPHX2
SCHEMBL8843381 0.86 MEN1 (0.73) GAAMEN1KMT2AEPHX2SMN1; SMN2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2025070619-A1 ELECTROCONDUCTIVE RESIN COMPOSITION, JOINED SHEET, METHOD FOR PRODUCING ELECTROCONDUCTIVE RESIN COMPOSITION, METHOD FOR PRODUCING JOINED BODY, AND JOINED BODY 日東電工株式会社 2025-04-03 WO disclosed
CN-108500511-A The manufacturing method of flux composition, solder composition, electric substrate and electric substrate 株式会社田村制作所 2018-09-07 CN disclosed