Ammonia Solution, Strong

Ammonia Solution, Strong

SCHEMBL28247173

N.O=S(=O)(Oc1ccccc1)c1ccccc1

nearest known ligand 0.70

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Predicted protein targets (top 18)

geneUniProtsupporting neighboursconfidence
▸ TDP1 Q9NUW8 2/20 0.70
▸ CA2 P00918 4/20 0.54
▸ CA1 P00915 2/20 0.54
▸ CA9 Q16790 2/20 0.54
▸ MAPT P10636 4/20 0.53
▸ ALDH1A1 P00352 4/20 0.53
▸ SMN1; SMN2 Q16637 2/20 0.53
▸ NPC1 O15118 2/20 0.53
▸ RAB9A P51151 2/20 0.53
▸ MAOB P27338 1/20 0.53
▸ CA12 O43570 2/20 0.49
▸ PARL Q9H300 1/20 0.48
▸ ENPP3 O14638 4/20 0.47
▸ ENPP1 P22413 4/20 0.47
▸ KMT2A Q03164 2/20 0.47
▸ KDM4E B2RXH2 1/20 0.47
▸ HPGD P15428 1/20 0.47
▸ ENPP2 Q13822 1/20 0.46

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Ammonia Solution, Strong SCHEMBL8363523 1.00 TDP1 (0.70) TDP1CA2CA1CA9MAPT
SCHEMBL19146 0.98 TDP1 (0.73) TDP1CA2CA1CA9MAPT
SCHEMBL7981247 0.98 TDP1 (0.73) TDP1CA2CA1CA9MAPT
SCHEMBL28075403 0.95 TDP1 (0.70) TDP1CA2CA1CA9MAPT
SCHEMBL1674227 0.95 TDP1 (0.70) TDP1CA2CA1CA9MAPT
SCHEMBL28934632 0.95 TDP1 (0.70) TDP1CA2CA1CA9MAPT
Benzene SCHEMBL27543065 0.95 TDP1 (0.70) TDP1CA2CA1CA9MAPT
SCHEMBL28157244 0.95 TDP1 (0.70) TDP1CA2CA1CA9MAPT
SCHEMBL28184027 0.95 TDP1 (0.70) TDP1CA2CA1CA9MAPT
Formaldehyde SCHEMBL9220828 0.93 TDP1 (0.68) TDP1CA2CA1CA9MAPT

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-108690193-A Polyimides, adhesive, adhesive material, adhesive layer, sheet adhesive, copper foil, copper-clad laminated board, wiring plate and manufacturing method 荒川化学工业株式会社 2018-10-23 — — CN disclosed
CN-108690194-A Polyimides, adhesive, adhesive material, adhesive layer, sheet adhesive, copper foil, copper-clad laminated board, wiring plate and manufacturing method 荒川化学工业株式会社 2018-10-23 — — CN disclosed
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