SCHEMBL28276795

SCHEMBL28276795

CC(=O)Oc1c(C)ccc(O)c1C

nearest known ligand 0.50

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
KDM4E B2RXH2 2/20 0.50
HSD17B10 Q99714 2/20 0.50
HTT P42858 2/20 0.50
TP53 P04637 1/20 0.50
GAA P10253 1/20 0.50
MAPT P10636 1/20 0.50
ALDH1A1 P00352 1/20 0.49
HPGD P15428 1/20 0.49
SCN5A Q14524 1/20 0.46
PREP P48147 3/20 0.42
CELA1 Q9UNI1 2/20 0.42
LMNA P02545 1/20 0.41
POLB P06746 1/20 0.40
ACHE P22303 2/20 0.40
PTPN1 P18031 2/20 0.40
PIM1 P11309 1/20 0.40
ELANE P08246 1/20 0.39
MAPK1 P28482 1/20 0.37
KDR P35968 1/20 0.37
CYP3A4 P08684 1/20 0.36

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL16450253 0.85 KDM4E (0.53) KDM4EHSD17B10HTTTP53GAA
SCHEMBL16265058 0.83 KDM4E (0.59) KDM4EHSD17B10HTTTP53GAA
SCHEMBL31268722 0.82 PIM1 (0.50) KDM4EHSD17B10HTTTP53GAA
SCHEMBL8949861 0.82 PIM1 (0.50) KDM4EHSD17B10HTTTP53GAA
SCHEMBL7947809 0.80 POLB (0.51) KDM4EHSD17B10HTTTP53GAA
SCHEMBL28144829 0.78 KDM4E (0.47) KDM4EHSD17B10HTTTP53GAA
SCHEMBL3137273 0.78 PREP (0.50) KDM4EHSD17B10HTTTP53GAA
SCHEMBL28465712 0.78 SCN5A (0.41) KDM4EHSD17B10HTTTP53GAA
SCHEMBL7538049 0.78 PIM1 (0.53) KDM4EHSD17B10HTTTP53GAA
SCHEMBL1133948 0.77 MAPT (0.46) KDM4EHSD17B10HTTTP53GAA

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-109313397-A The manufacturing method of laminated body, the manufacturing method of semiconductor element and laminated body 富士胶片株式会社 2019-02-05 CN disclosed