⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL1154841 | 0.94 | — | — | |
| SCHEMBL242746 | 0.94 | CYP2C9 (0.31) | — | |
| SCHEMBL2825298 | 0.94 | CYP2C9 (0.31) | — | |
| SCHEMBL29107328 | 0.89 | — | — | |
| Bromide SCHEMBL4768118 | 0.89 | — | — | |
| Adamantane SCHEMBL8979787 | 0.89 | CYP2C9 (0.38) | — | |
| Hydrochloric Acid SCHEMBL28813180 | 0.89 | — | — | |
| Hydrogen Peroxide SCHEMBL28741420 | 0.84 | CYP2C9 (0.35) | — | |
| Hydrazine SCHEMBL28816515 | 0.80 | LMNA (0.32) | — | |
| Bromomethane SCHEMBL4780138 | 0.80 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 11 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-3151270-B1 | SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING SAME | DENKA COMPANY LTD (JP) | 2022-06-01 | — | — | EP | claimed |
| EP-3564993-B1 | HEAT DISSIPATION COMPONENT FOR SEMICONDUCTOR ELEMENT | DENKA COMPANY LTD (JP) | 2021-09-29 | — | — | EP | claimed |
| EP-2325153-B1 | PROCESS FOR PRODUCTION OF ALUMINUM-DIAMOND COMPOSITE | DENKI KAGAKU KOGYO KK (JP) | 2014-10-01 | — | — | EP | claimed |
| WO-2021025109-A1 | LASER AMPLIFIER | 国立大学法人大阪大学 | 2021-02-11 | — | — | WO | disclosed |
| WO-2021024457-A1 | LASER AMPLIFIER | 国立大学法人大阪大学 | 2021-02-11 | — | — | WO | disclosed |
| EP-3008979-B1 | COOLED MULTILAYER PRINTED CIRCUIT BOARD WITH LOW DIELECTRIC LOSS | THALES SA (FR) | 2017-05-03 | — | — | EP | disclosed |
| WO-2017065139-A1 | ALUMINUM-DIAMOND COMPOSITE AND METHOD FOR PRODUCING SAME | デンカ株式会社 | 2017-04-20 | — | — | WO | disclosed |
| EP-3008979-A1 | COOLED PRINTED CIRCUIT WITH MULTI-LAYER STRUCTURE AND LOW DIELECTRIC LOSSES | Thales (FR) | 2016-04-20 | — | — | EP | disclosed |
| WO-2014198688-A1 | COOLED PRINTED CIRCUIT WITH MULTI-LAYER STRUCTURE AND LOW DIELECTRIC LOSSES | THALES (FR) | 2014-12-18 | — | — | WO | disclosed |
| WO-2010007922-A1 | ALUMINUM-DIAMOND COMPOSITE AND METHOD FOR PRODUCING THE SAME | 電気化学工業株式会社 (JP) | 2010-01-21 | — | — | WO | disclosed |
| WO-2010007974-A1 | PROCESS FOR PRODUCTION OF ALUMINUM-DIAMOND COMPOSITE | 電気化学工業株式会社 (JP) | 2010-01-21 | — | — | WO | disclosed |