⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL28098910 | 1.00 | — | — | |
| SCHEMBL2219160 | 0.91 | — | — | |
| SCHEMBL17694848 | 0.70 | — | — | |
| SCHEMBL937448 | 0.69 | — | — | |
| SCHEMBL3493461 | 0.67 | — | — | |
| SCHEMBL1572948 | 0.65 | — | — | |
| SCHEMBL26793982 | 0.65 | — | — | |
| SCHEMBL4528494 | 0.63 | — | — | |
| SCHEMBL28177845 | 0.63 | — | — | |
| SCHEMBL9130393 | 0.63 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-107039239-B | Wafer processing body and wafer processing method | 信越化学工业株式会社 | 2022-01-11 | — | — | CN | disclosed |
| CN-105960697-B | Wafer processing body, temporary bonding material for wafer processing, and method for manufacturing thin wafer | 信越化学工业株式会社 | 2019-06-11 | — | — | CN | disclosed |
| CN-106104765-B | The manufacturing method of chip processome, chip processing temporary sticky material and slim chip | 信越化学工业株式会社 | 2019-05-14 | — | — | CN | disclosed |