Phosphonic Acid

Phosphonic Acid

SCHEMBL28320519

CCCCCN.N.O=[PH](O)O

nearest known ligand 0.60

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Predicted protein targets (top 18)

geneUniProtsupporting neighboursconfidence
DNM1 Q05193 8/20 0.60
MEN1 O00255 1/20 0.60
KMT2A Q03164 1/20 0.60
ALDH1A1 P00352 1/20 0.60
TSHR P16473 1/20 0.60
EPHX1 P07099 1/20 0.60
GABBR2 O75899 1/20 0.43
GABRR1 P24046 1/20 0.43
GABBR1 Q9UBS5 1/20 0.43
GNAI3 P08754 1/20 0.39
GNAO1 P09471 1/20 0.39
GNAI1 P63096 1/20 0.39
PAOX Q6QHF9 1/20 0.37
SPHK2 Q9NRA0 1/20 0.37
SPHK1 Q9NYA1 1/20 0.37
NFKB1 P19838 1/20 0.37
SLC6A5 Q9Y345 1/20 0.37
FDPS P14324 1/20 0.37

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Phosphonic Acid SCHEMBL9574278 0.97 DNM1 (0.63) DNM1MEN1KMT2AALDH1A1TSHR
Hexadecylamine SCHEMBL28888789 0.95 DNM1 (0.68) DNM1MEN1KMT2AALDH1A1TSHR
Octadecylamine SCHEMBL15768529 0.95 DNM1 (0.68) DNM1MEN1KMT2AALDH1A1TSHR
Phosphonic Acid SCHEMBL27968007 0.95 DNM1 (0.60) DNM1MEN1KMT2AALDH1A1TSHR
Dodecylamine SCHEMBL29220059 0.92 DNM1 (0.65) DNM1MEN1KMT2AALDH1A1TSHR
SCHEMBL21271991 0.90 DNM1 (0.60) DNM1MEN1KMT2AALDH1A1TSHR
Butylamine SCHEMBL3361661 0.89
SCHEMBL17028004 0.87 DNM1 (0.65) DNM1MEN1KMT2AALDH1A1TSHR
Hexane SCHEMBL5091030 0.83 TSHR (0.50) MEN1KMT2AALDH1A1TSHR
Hexane SCHEMBL3795665 0.83 TSHR (0.50) MEN1KMT2AALDH1A1TSHR

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-110072961-A Adhesive composition and cover film, bonding sheet, copper clad laminate and the electromagnetic shielding material for using it 东亚合成株式会社 2019-07-30 CN disclosed