SCHEMBL2834445

SCHEMBL2834445

CC(C)[N+](C(C)C)(C(C)C)C(C)C.O=[N+]([O-])[O-]

nearest known ligand 0.40

Predicted protein targets (top 6)

geneUniProtsupporting neighboursconfidence
MEN1 O00255 1/20 0.40
KMT2A Q03164 1/20 0.40
TSHR P16473 1/20 0.32
ALDH1A1 P00352 1/20 0.32
HPGD P15428 1/20 0.32
HIF1A Q16665 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL8203777 0.76
SCHEMBL8200971 0.76 MEN1 (0.38) MEN1KMT2ATSHRALDH1A1HPGD
SCHEMBL8192716 0.73 MEN1 (0.35) MEN1KMT2A
SCHEMBL8201539 0.73 MEN1 (0.35) MEN1KMT2A
Bromide SCHEMBL1271543 0.71
SCHEMBL192598 0.71 MEN1 (0.75) MEN1KMT2ATSHRALDH1A1HPGD
Perchlorate SCHEMBL9228246 0.69
SCHEMBL15516311 0.69
SCHEMBL7538221 0.69
SCHEMBL14860315 0.69 ALDH1A1 (0.46) MEN1KMT2ATSHRALDH1A1HPGD

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 16 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2683792-B1 NOVEL ETCHING COMPOSITION FUJIFILM ELECTRONIC MAT USA INC (US) 2019-09-25 EP disclosed
EP-2807289-B1 ETCHING COMPOSITION FUJIFILM ELECTRONIC MATERIALS (US) 2016-09-21 EP disclosed
US-9200372-B2 Passivation composition and process FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. (US) 2015-12-01 US disclosed
EP-2807289-A1 ETCHING COMPOSITION FujiFilm Electronic Materials USA, Inc. (US) 2014-12-03 EP disclosed
US-8889025-B2 Etching composition FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. (US) 2014-11-18 US disclosed
US-20140120734-A1 Novel Etching Composition FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. (US) 2014-05-01 US disclosed
US-8709277-B2 Etching composition FUJIFILM CORPORATION (JP) 2014-04-29 US disclosed
WO-2014039186-A1 ETCHING COMPOSITION FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. (US) 2014-03-13 WO disclosed
US-20140073140-A1 Etching Composition FUJIFILM CORPORATION (JP) 2014-03-13 US disclosed
US-8647523-B2 Etching composition FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. (US) 2014-02-11 US disclosed
EP-2683792-A1 NOVEL ETCHING COMPOSITION FujiFilm Electronic Materials USA, Inc. (US) 2014-01-15 EP disclosed
US-20130122701-A1 Novel Passivation Composition and Process FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. (US) 2013-05-16 US disclosed
WO-2013059806-A1 Novel Passivation Composition and Process FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. (US) 2013-04-25 WO disclosed
WO-2012125401-A1 NOVEL ETCHING COMPOSITION FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. (US) 2012-09-20 WO disclosed
US-20120231632-A1 Novel Etching Composition FUJIFILM CORPORATION (JP) 2012-09-13 US disclosed
US-20100072418-A1 Polishing slurry FUJIFILM CORPORATION (JP) 2010-03-25 US disclosed