⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL16575221 | 0.75 | — | — | |
| SCHEMBL789796 | 0.75 | — | — | |
| SCHEMBL14391626 | 0.75 | — | — | |
| SCHEMBL23875131 | 0.73 | — | — | |
| SCHEMBL26448874 | 0.73 | — | — | |
| SCHEMBL18885184 | 0.73 | — | — | |
| SCHEMBL12096028 | 0.71 | — | — | |
| SCHEMBL8230365 | 0.69 | — | — | |
| SCHEMBL10276321 | 0.69 | — | — | |
| SCHEMBL15025844 | 0.67 | TSHR (0.41) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 7 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-113785243-A | Composition for resist pattern metallization process | 日产化学株式会社 | 2021-12-10 | — | — | CN | disclosed |
| CN-106662820-B | Composition for forming silicon-containing resist underlayer film having halosulfonylalkyl group | 日产化学工业株式会社 | 2021-06-22 | — | — | CN | disclosed |
| CN-107406383-B | Compound for lithography, resin, and underlayer film forming material | 三菱瓦斯化学株式会社 | 2021-01-26 | — | — | CN | disclosed |
| CN-107075302-B | Film-forming composition containing crosslinking reactive silicon | 日产化学工业株式会社 | 2020-08-04 | — | — | CN | disclosed |
| CN-104737076-B | Composition for forming silicon-containing resist underlayer film having ester group | 日产化学工业株式会社 | 2020-04-03 | — | — | CN | disclosed |
| CN-106502052-B | Etching-resistant phenolic aldehyde positive photoresist | 潍坊星泰克微电子材料有限公司 | 2020-01-14 | — | — | CN | disclosed |
| CN-106133607-B | Resist underlayer film forming composition containing aromatic vinyl compound-added novolak resin | 日产化学工业株式会社 | 2020-01-03 | — | — | CN | disclosed |