SCHEMBL28367456

SCHEMBL28367456

N#Cc1cc(-c2ccccc2)c(F)c(F)c1C#N

nearest known ligand 0.44

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 5/20 0.44
HPGD P15428 4/20 0.44
KDM4E B2RXH2 4/20 0.44
CYP1A2 P05177 2/20 0.44
CYP2C9 P11712 2/20 0.44
CYP2C19 P33261 2/20 0.44
NPSR1 Q6W5P4 2/20 0.44
GALR3 O60755 1/20 0.44
GAA P10253 1/20 0.44
ADORA2A P29274 3/20 0.43
ADORA1 P30542 3/20 0.43
L3MBTL1 Q9Y468 2/20 0.42
MAPK1 P28482 1/20 0.42
ATM Q13315 1/20 0.41
SQOR Q9Y6N5 2/20 0.41
HSD17B10 Q99714 1/20 0.41
TDP1 Q9NUW8 1/20 0.40
RXFP1 Q9HBX9 1/20 0.40
CYP11B1 P15538 1/20 0.40
CYP11B2 P19099 1/20 0.40

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL28350234 0.84 ADORA1 (0.44) ALDH1A1HPGDKDM4ECYP1A2CYP2C9
SCHEMBL30609601 0.83 ALDH1A1 (0.42) ALDH1A1HPGDKDM4ECYP1A2CYP2C9
SCHEMBL17540367 0.83 ALDH1A1 (0.49) ALDH1A1HPGDKDM4ECYP1A2CYP2C9
SCHEMBL16122525 0.83 ALDH1A1 (0.42) ALDH1A1HPGDKDM4ECYP1A2CYP2C9
SCHEMBL17545814 0.81 ADORA2A (0.43) ALDH1A1HPGDKDM4ECYP1A2CYP2C9
SCHEMBL22512473 0.81 ADORA2A (0.47) ALDH1A1HPGDKDM4ECYP1A2CYP2C9
SCHEMBL11132593 0.79 ADORA1 (0.50) ALDH1A1HPGDKDM4ECYP1A2CYP2C9
SCHEMBL16122477 0.79 ADORA2A (0.44) ALDH1A1HPGDKDM4ECYP1A2CYP2C9
SCHEMBL17337245 0.79 ALDH1A1 (0.51) ALDH1A1HPGDKDM4ECYP1A2CYP2C9
SCHEMBL16122425 0.77 ADORA1 (0.51) ALDH1A1HPGDKDM4ECYP1A2CYP2C9

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-110997755-B Resin composition, prepreg, metal foil-clad laminate, resin sheet, and printed wiring board 三菱瓦斯化学株式会社 2022-05-03 CN disclosed
CN-109415489-B Resin composition, resin sheet, multilayer printed wiring board, and semiconductor device 三菱瓦斯化学株式会社 2022-03-04 CN disclosed
CN-108779330-B Resin composition, prepreg, metal foil-clad laminate, resin sheet, and printed wiring board 三菱瓦斯化学株式会社 2019-12-17 CN disclosed