⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL22613944 | 1.00 | — | — | |
| SCHEMBL584025 | 1.00 | — | — | |
| SCHEMBL10076656 | 1.00 | — | — | |
| SCHEMBL3482084 | 0.83 | MEN1 (0.33) | — | |
| SCHEMBL21907033 | 0.82 | — | — | |
| SCHEMBL20063851 | 0.82 | — | — | |
| SCHEMBL25475080 | 0.80 | — | — | |
| SCHEMBL22702390 | 0.80 | — | — | |
| SCHEMBL22171619 | 0.80 | — | — | |
| SCHEMBL5558327 | 0.80 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 72 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-107936552-B | Glass filler reinforced polyamide moulding materials based on amorphous copolyamides | EMS专利股份公司 | 2021-10-26 | — | — | CN | claimed |
| EP-3309199-B1 | GLASS FILLER REINFORCED POLYAMIDE MOLDING MATERIALS BASED ON AMORPHOUS COPOLYAMIDES | EMS PATENT AG (CH) | 2020-04-01 | — | — | EP | claimed |
| US-20180100064-A1 | GLASS FILLER-REINFORCED POLYAMIDE MOULDING COMPOUNDS BASED ON AMORPHOUS COPOLYAMIDES | EMS-PATENT AG (CH) | 2018-04-12 | — | — | US | claimed |
| EP-2291457-B1 | POLYAMIDE MOULDED MASSES CONTAINING SEMI-CRYSTALLINE TRANSPARENT COPOLYAMIDES FOR PRODUCING HIGHLY FLEXIBLE TRANSPARENT MOULDED PARTS WITH HIGH NOTCH-IMPACT STRENGTH, LOW WATER ABSORBENCY AND EXCELLENT RESISTANCE TO CHEMICALS | EMS PATENT AG (CH) | 2017-04-05 | — | — | EP | claimed |
| US-7005248-B2 | Method of forming cavity between multilayered wirings | JSR CORPORATION (JP) | 2006-02-28 | — | — | US | claimed |
| EP-3704094-B1 | MODULATORS OF THE INTEGRATED STRESS PATHWAY | CALICO LIFE SCIENCES LLC (US) | 2026-03-11 | — | — | EP | disclosed |
| CN-119684161-A | Compound containing ureido structure, negative photosensitive resin composition, and preparation method and application thereof | 波米科技有限公司 | 2025-03-25 | — | — | CN | disclosed |
| CN-117279780-B | Laminated substrate, laminated body manufacturing method, laminated body with member for electronic device, and electronic device manufacturing method | ＡＧＣ株式会社 | 2024-08-16 | — | — | CN | disclosed |
| US-20240166652-A1 | MODULATORS OF THE INTEGRATED STRESS PATHWAY | ABBVIE INC. | 2024-05-23 | — | — | US | disclosed |
| CN-113136103-B | Polyimide precursor resin composition | 旭化成株式会社 | 2024-05-03 | — | — | CN | disclosed |
| CN-114656636-B | Polyester imide and preparation method thereof | 苏州瀚海新材料有限公司 | 2024-03-26 | — | — | CN | disclosed |
| CN-117279780-A | Laminated substrate, laminated body manufacturing method, laminated body with member for electronic device, and electronic device manufacturing method | ＡＧＣ株式会社 | 2023-12-22 | — | — | CN | disclosed |
| EP-1321487-A1 | POLYAMIC ACID, POLYIMIDE, PROCESS FOR PRODUCING THESE, AND FILM OF THE POLYIMIDE | Mitsui Chemicals, Inc. (JP) | 2003-06-25 | — | — | EP | disclosed |
| US-6554962-B2 | Sheet-like member of very fine glass particles and polyamide; formed by a paper-making technique; input resistance properties; moisture-proofness; heat resistance; interfacial polymerization | SONY CORPORATION (JP) | 2003-04-29 | — | — | US | disclosed |
| US-20020188090-A1 | Polyamic acid, polyimide, process for producing these, and film of the polyimide | MITSUI CHEMICALS, INC. (JP) | 2002-12-12 | — | — | US | disclosed |
| US-20020096298-A1 | Loudspeaker and method for the preparation thereof | SONY CORPORATION (JP) | 2002-07-25 | — | — | US | disclosed |
| CN-1318964-A | Loudspeaker and its mfg. | SONY CORP (JP) | 2001-10-24 | — | — | CN | disclosed |
| EP-1146770-A2 | Loudspeaker and method for the preperation thereof | SONY CORPORATION (JP) | 2001-10-17 | — | — | EP | disclosed |
| US-6207364-B1 | BOTH SURFACES WHICH ARE COVERED WITH A RESIN THERMAL SHRINKAGE RATIO OF NOT MORE THAN 0.02% AT 150 DEGREES C. FOR 30 MINUTES, AND AN IMAGE FORMING LAYER COMPRISING AN ORGANIC SILVER. | KONICA CORPORATION (JP) | 2001-03-27 | — | — | US | disclosed |
| EP-0952482-A1 | Thermally developable material | KONICA CORPORATION (JP) | 1999-10-27 | — | — | EP | disclosed |