Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | MEN1 | O00255 | 4/20 | 0.60 |
| ▸ | KMT2A | Q03164 | 4/20 | 0.60 |
| ▸ | ALDH1A1 | P00352 | 2/20 | 0.57 |
| ▸ | MAPK1 | P28482 | 2/20 | 0.57 |
| ▸ | HSD17B10 | Q99714 | 1/20 | 0.57 |
| ▸ | RXFP1 | Q9HBX9 | 1/20 | 0.55 |
| ▸ | SMN1; SMN2 | Q16637 | 1/20 | 0.53 |
| ▸ | KDM4E | B2RXH2 | 1/20 | 0.53 |
| ▸ | KCNK3 | O14649 | 2/20 | 0.52 |
| ▸ | KCNK9 | Q9NPC2 | 2/20 | 0.52 |
| ▸ | RAB9A | P51151 | 1/20 | 0.51 |
| ▸ | SGMS2 | Q8NHU3 | 1/20 | 0.50 |
| ▸ | PTGS1 | P23219 | 1/20 | 0.50 |
| ▸ | F10 | P00742 | 1/20 | 0.49 |
| ▸ | MAPT | P10636 | 1/20 | 0.49 |
| ▸ | GAA | P10253 | 1/20 | 0.49 |
| ▸ | TSHR | P16473 | 1/20 | 0.49 |
| ▸ | MITF | O75030 | 1/20 | 0.49 |
| ▸ | LMNA | P02545 | 1/20 | 0.49 |
| ▸ | POLB | P06746 | 1/20 | 0.49 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL8974333 | 0.91 | KDM4E (0.53) | MEN1KMT2AALDH1A1MAPK1HSD17B10 | |
| SCHEMBL28213376 | 0.85 | KMT2A (0.68) | MEN1KMT2AALDH1A1MAPK1HSD17B10 | |
| SCHEMBL9289398 | 0.83 | MAOB (0.58) | ALDH1A1HSD17B10SMN1; SMN2KDM4EPTGS1 | |
| SCHEMBL28740096 | 0.81 | MAOB (0.45) | MEN1KMT2AALDH1A1MAPK1HSD17B10 | |
| SCHEMBL6408304 | 0.81 | MEN1 (0.69) | MEN1KMT2AALDH1A1MAPK1HSD17B10 | |
| SCHEMBL29363351 | 0.80 | MAOB (0.53) | MEN1KMT2AALDH1A1MAPK1HSD17B10 | |
| SCHEMBL28539202 | 0.80 | MAOB (0.53) | MEN1KMT2AALDH1A1MAPK1HSD17B10 | |
| SCHEMBL13894164 | 0.79 | RXFP1 (0.58) | MEN1KMT2AALDH1A1MAPK1HSD17B10 | |
| SCHEMBL8609529 | 0.79 | PBRM1 (0.54) | MEN1KMT2AALDH1A1MAPK1HSD17B10 | |
| SCHEMBL13265784 | 0.78 | FFAR1 (0.55) | MEN1KMT2AALDH1A1MAPK1HSD17B10 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 42 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-118240361-A | Resin composition | 南亚塑胶工业股份有限公司 | 2024-06-25 | — | — | CN | disclosed |
| CN-117986861-A | Resin composition and electronic component | 南亚塑胶工业股份有限公司 | 2024-05-07 | — | — | CN | disclosed |
| CN-117794048-A | Metal-clad laminate, circuit board, electronic device, and electronic apparatus | 日铁化学材料株式会社 | 2024-03-29 | — | — | CN | disclosed |
| CN-115971017-B | Method for producing polyimide film, method for producing metal-clad laminate, and method for producing circuit board | 日铁化学材料株式会社 | 2024-01-16 | — | — | CN | disclosed |
| CN-111746080-B | Metal-clad laminate and circuit board | 日铁化学材料株式会社 | 2024-01-16 | — | — | CN | disclosed |
| CN-117279198-A | Metal-clad laminate, circuit board, electronic device, and electronic apparatus | 日铁化学材料株式会社 | 2023-12-22 | — | — | CN | disclosed |
| CN-117067718-A | Metal-clad laminate and circuit board | 日铁化学材料株式会社 | 2023-11-17 | — | — | CN | disclosed |
| CN-117048152-A | Method for manufacturing metal-clad laminate | 日铁化学材料株式会社 | 2023-11-14 | — | — | CN | disclosed |
| CN-113874420-B | Resin film and metal-clad laminate | 日铁化学材料株式会社 | 2023-09-26 | — | — | CN | disclosed |
| CN-116731318-A | polyimide resin | 南亚塑胶工业股份有限公司 | 2023-09-12 | — | — | CN | disclosed |
| CN-113043690-A | Metal-clad laminate and circuit board | 日铁化学材料株式会社 | 2021-06-29 | — | — | CN | disclosed |
| CN-108699243-B | Polyamic acid, thermoplastic polyimide, resin film, laminate, and circuit board | 日铁化学材料株式会社 | 2021-05-18 | — | — | CN | disclosed |
| CN-112601656-A | Method for manufacturing metal-clad laminate and method for manufacturing circuit board | 日铁化学材料株式会社 | 2021-04-02 | — | — | CN | disclosed |
| CN-112571901-A | Polyimide film, metal-clad laminate, and circuit board | 日铁化学材料株式会社 | 2021-03-30 | — | — | CN | disclosed |
| CN-112469560-A | Metal-clad laminate and circuit board | 日铁化学材料株式会社 | 2021-03-09 | — | — | CN | disclosed |
| CN-111746080-A | Metal-clad laminate and circuit board | 日铁化学材料株式会社 | 2020-10-09 | — | — | CN | disclosed |
| CN-111132456-A | Metal-clad laminate, circuit board, multilayer circuit board, and method for manufacturing same | 日铁化学材料株式会社 | 2020-05-08 | — | — | CN | disclosed |
| CN-110962410-A | Metal-clad laminate and circuit board | 日铁化学材料株式会社 | 2020-04-07 | — | — | CN | disclosed |
| CN-110871606-A | Metal-clad laminate, adhesive sheet, adhesive polyimide resin composition, and circuit board | 日铁化学材料株式会社 | 2020-03-10 | — | — | CN | disclosed |
| CN-104519657-B | Copper-cover laminated plate, printing distributing board and its application method | 新日铁住金化学株式会社 | 2018-04-06 | — | — | CN | disclosed |