⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL28457405 | 0.87 | — | — | |
| SCHEMBL28449355 | 0.81 | — | — | |
| SCHEMBL28452926 | 0.80 | THRB (0.31) | — | |
| SCHEMBL28897804 | 0.79 | — | — | |
| SCHEMBL4614482 | 0.76 | — | — | |
| SCHEMBL8923212 | 0.74 | — | — | |
| SCHEMBL26030 | 0.74 | — | — | |
| SCHEMBL8667750 | 0.72 | — | — | |
| SCHEMBL1608622 | 0.71 | — | — | |
| SCHEMBL23295170 | 0.71 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 10 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-116075368-B | Resin composition, cured product, method for producing same, and laminate | 三菱化学株式会社 | 2024-06-11 | — | — | CN | disclosed |
| CN-116075368-A | Resin composition, cured product, method for producing same, and laminate | 三菱化学株式会社 | 2023-05-05 | — | — | CN | disclosed |
| CN-110249004-B | Polyimide precursor composition | 东京应化工业株式会社 | 2022-07-19 | — | — | CN | disclosed |
| CN-108389512-B | Laminate, flexible device, and method for producing laminate | 东京应化工业株式会社 | 2022-04-15 | — | — | CN | disclosed |
| CN-108250754-B | Silicon-containing resin composition, silicon-containing resin film, silica film, light-emitting display element panel, and light-emitting display device | 东京应化工业株式会社 | 2022-01-25 | — | — | CN | disclosed |
| CN-108387954-B | Laminate, flexible device, and method for producing laminate | 东京应化工业株式会社 | 2022-01-18 | — | — | CN | disclosed |
| CN-107709464-B | Silicon-containing resin composition | 东京应化工业株式会社 | 2021-09-28 | — | — | CN | disclosed |
| CN-112334795-A | Liquid composition, quantum dot-containing film, optical film, light-emitting display element panel, and light-emitting display device | 东京应化工业株式会社 | 2021-02-05 | — | — | CN | disclosed |
| CN-107429059-B | Energy-sensitive resin composition | 东京应化工业株式会社 | 2020-10-23 | — | — | CN | disclosed |
| CN-107922733-B | Polyimide precursor composition | 东京应化工业株式会社 | 2020-09-11 | — | — | CN | disclosed |