SCHEMBL28482197

SCHEMBL28482197

CCSCCOCCSCCc1ccccn1

nearest known ligand 0.50

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 3/20 0.47
NPC1 O15118 1/20 0.47
RAB9A P51151 1/20 0.47
HTT P42858 2/20 0.46
MAPK1 P28482 1/20 0.46
KDM4E B2RXH2 1/20 0.45
MAPT P10636 1/20 0.45
HRH3 Q9Y5N1 1/20 0.42
TP53 P04637 1/20 0.42
HRH1 P35367 1/20 0.42
LMNA P02545 2/20 0.41
PKM P14618 1/20 0.41
TAAR1 Q96RJ0 1/20 0.41
ALOX15 P16050 1/20 0.41
MEN1 O00255 1/20 0.41
KMT2A Q03164 1/20 0.41
CA12 O43570 1/20 0.40
CA1 P00915 1/20 0.40
CA2 P00918 1/20 0.40
CA9 Q16790 1/20 0.40

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL29152281 0.98 ALDH1A1 (0.46) ALDH1A1NPC1RAB9AHTTMAPK1
SCHEMBL22922289 0.92 HTT (0.51) ALDH1A1NPC1RAB9AHTTMAPK1
SCHEMBL22922299 0.91 HTT (0.50) ALDH1A1NPC1RAB9AHTTMAPK1
SCHEMBL8508295 0.89 HTT (0.51) ALDH1A1NPC1RAB9AHTTMAPK1
SCHEMBL28478859 0.89 HTT (0.51) ALDH1A1NPC1RAB9AHTTMAPK1
SCHEMBL8280335 0.89 HRH1 (0.52) ALDH1A1NPC1RAB9AHTTMAPK1
SCHEMBL28477405 0.86 HTT (0.49) ALDH1A1NPC1RAB9AHTTMAPK1
SCHEMBL28480685 0.86 HTT (0.49) ALDH1A1NPC1RAB9AHTTMAPK1
SCHEMBL28482442 0.84 HTT (0.48) ALDH1A1NPC1RAB9AHTTMAPK1
SCHEMBL21427718 0.80 HTT (0.52) ALDH1A1NPC1RAB9AHTTMAPK1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-111918985-A Composition for tin-silver alloy electroplating comprising complexing agent 巴斯夫欧洲公司 2020-11-10 CN claimed
CN-111918985-A Composition for tin-silver alloy electroplating comprising complexing agent 巴斯夫欧洲公司 2020-11-10 CN disclosed