SCHEMBL28489798

SCHEMBL28489798

C=C(CCOCSc1ccc2ccccc2c1)C(=O)O

nearest known ligand 0.48

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ANPEP P15144 1/20 0.43
CNR2 P34972 2/20 0.38
HDAC3 O15379 1/20 0.38
HDAC4 P56524 1/20 0.38
HDAC1 Q13547 1/20 0.38
HDAC7 Q8WUI4 1/20 0.38
HDAC2 Q92769 1/20 0.38
HDAC10 Q969S8 1/20 0.38
HDAC11 Q96DB2 1/20 0.38
HDAC8 Q9BY41 1/20 0.38
HDAC6 Q9UBN7 1/20 0.38
HDAC9 Q9UKV0 1/20 0.38
HDAC5 Q9UQL6 1/20 0.38
LMNA P02545 2/20 0.38
STAT3 P40763 1/20 0.38
KDM4E B2RXH2 4/20 0.37
ALDH1A1 P00352 4/20 0.37
PTPN7 P35236 1/20 0.37
MAPT P10636 6/20 0.37
TDP1 Q9NUW8 2/20 0.37

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL17556075 0.92 ANPEP (0.42) ANPEPCNR2HDAC3HDAC4HDAC1
SCHEMBL28491504 0.86 ALDH1A1 (0.45) HDAC3HDAC4HDAC1HDAC7HDAC2
SCHEMBL17800202 0.84 ANPEP (0.49) ANPEPCNR2HDAC3HDAC4HDAC1
SCHEMBL3743704 0.82 CNR2 (0.49) ANPEPCNR2HDAC3HDAC4HDAC1
SCHEMBL29638885 0.82 CNR2 (0.49) ANPEPCNR2HDAC3HDAC4HDAC1
SCHEMBL17556001 0.81 HDAC1 (0.53) ANPEPCNR2HDAC3HDAC4HDAC1
SCHEMBL29638887 0.81 HDAC1 (0.53) ANPEPCNR2HDAC3HDAC4HDAC1
SCHEMBL17556066 0.80 HDAC1 (0.55) ANPEPCNR2HDAC3HDAC4HDAC1
SCHEMBL17556043 0.80 HDAC1 (0.55) ANPEPCNR2HDAC3HDAC4HDAC1
SCHEMBL17556063 0.80 HDAC1 (0.55) ANPEPCNR2HDAC3HDAC4HDAC1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 16 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-115521230-A Silicon-containing monomer, photocuring composition, packaging film and organic electroluminescent device comprising packaging film 吉林奥来德光电材料股份有限公司 2022-12-27 CN claimed
CN-114957314-A Compound for film packaging, composition, packaging film and film packaging structure 吉林奥来德光电材料股份有限公司 2022-08-30 CN claimed
CN-114685551-B Compound for packaging film, composition and packaging film 吉林奥来德光电材料股份有限公司 2023-12-26 CN disclosed
CN-113603614-B Compound, compound composed of compound, application and display panel 吉林奥来德光电材料股份有限公司 2023-04-07 CN disclosed
CN-115521230-A Silicon-containing monomer, photocuring composition, packaging film and organic electroluminescent device comprising packaging film 吉林奥来德光电材料股份有限公司 2022-12-27 CN disclosed
CN-114957314-A Compound for film packaging, composition, packaging film and film packaging structure 吉林奥来德光电材料股份有限公司 2022-08-30 CN disclosed
CN-114685551-A Compound for packaging film, composition and packaging film 吉林奥来德光电材料股份有限公司 2022-07-01 CN disclosed
CN-113135952-B Light-cured monomer, light-cured composition, packaging film and display device 吉林奥来德光电材料股份有限公司 2022-06-17 CN disclosed
CN-111875521-B Compound for packaging film, preparation method thereof, curable composition and packaging film 吉林奥来德光电材料股份有限公司 2022-05-10 CN disclosed
CN-112538031-B Antioxidant for thin film packaging, composition and application thereof 吉林奥来德光电材料股份有限公司 2022-05-06 CN disclosed
CN-113801260-A Compound for film packaging, photocuring composition and film packaging layer 吉林奥来德光电材料股份有限公司 2021-12-17 CN disclosed
CN-113603614-A Compound, compound formed by compound, application and display panel 吉林奥来德光电材料股份有限公司 2021-11-05 CN disclosed
CN-113402542-A Compound for packaging film, ink composition containing compound and film packaging structure 吉林奥来德光电材料股份有限公司 2021-09-17 CN disclosed
CN-113135952-A Photocuring monomer, photocuring composition, packaging film and display device 吉林奥来德光电材料股份有限公司 2021-07-20 CN disclosed
CN-112538031-A Antioxidant for thin film packaging, composition and application thereof 吉林奥来德光电材料股份有限公司 2021-03-23 CN disclosed
CN-111875521-A Compound for packaging film, preparation method of compound, curable composition and packaging film 吉林奥来德光电材料股份有限公司 2020-11-03 CN disclosed