SCHEMBL28505751

SCHEMBL28505751

O=S(=O)(O)OCCCS.[NaH]

nearest known ligand 0.42

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
FNTA P49354 2/20 0.39
FNTB P49356 2/20 0.39
PTGS1 P23219 1/20 0.36
PDE4A P27815 1/20 0.36
CA2 P00918 10/20 0.35
CA1 P00915 9/20 0.35
CA9 Q16790 7/20 0.35
KDM4E B2RXH2 1/20 0.35
USP2 O75604 1/20 0.35
ALDH1A1 P00352 1/20 0.35
LMNA P02545 1/20 0.35
MMP9 P14780 1/20 0.35
ALOX15 P16050 1/20 0.35
TSHR P16473 1/20 0.35
CA12 O43570 2/20 0.33
CA3 P07451 2/20 0.33
CA4 P22748 2/20 0.33
CA6 P23280 2/20 0.33
CA5A P35218 2/20 0.33
CA7 P43166 2/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL17183009 0.97
SCHEMBL17183004 0.88 FNTA (0.46) FNTAFNTBPTGS1PDE4ACA2
SCHEMBL3655506 0.88 FNTA (0.46) FNTAFNTBPTGS1PDE4ACA2
SCHEMBL17183010 0.88 FNTA (0.46) FNTAFNTBPTGS1PDE4ACA2
SCHEMBL153103 0.81
SCHEMBL923333 0.81 FNTA (0.45) FNTAFNTBCA2CA1CA9
SCHEMBL3640927 0.81 CA2 (0.50) FNTAFNTBCA2CA1CA9
SCHEMBL17456416 0.78 FNTA (0.48) FNTAFNTBCA2CA1CA9
SCHEMBL721222 0.78 FNTA (0.53) FNTAFNTBCA2CA1CA9
SCHEMBL5788200 0.78 FNTA (0.53) FNTAFNTBCA2CA1CA9

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-113445081-A Additive for electrolytic copper foil, electrolyte for electrolytic copper foil, copper foil and method for producing the same 江西理工大学 2021-09-28 CN claimed
CN-115679397-A High-dispersity electroplating hard copper additive and preparation method thereof 江苏梦得新材料科技有限公司 2023-02-03 CN disclosed
CN-112226790-B Production method of ultrathin high-strength electronic copper foil 九江德福科技股份有限公司 2022-04-22 CN disclosed
CN-112226790-A Production method of ultrathin high-strength electronic copper foil 九江德福科技股份有限公司 2021-01-15 CN disclosed