SCHEMBL285315

SCHEMBL285315

CC1CCC(C(=O)OCC2CO2)C(C(=O)OCC2CO2)C1

nearest known ligand 0.69

Predicted protein targets (top 10)

geneUniProtsupporting neighboursconfidence
TP53 P04637 1/20 0.69
CYP3A4 P08684 1/20 0.69
ALDH1A1 P00352 1/20 0.46
TRPM8 Q7Z2W7 1/20 0.35
TSHR P16473 2/20 0.35
MAPK1 P28482 1/20 0.35
LMNA P02545 1/20 0.35
SMN1; SMN2 Q16637 1/20 0.34
EPHX1 P07099 1/20 0.34
MGLL Q99685 2/20 0.34

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL27564921 0.92 TP53 (0.58) TP53CYP3A4ALDH1A1TRPM8LMNA
SCHEMBL31688117 0.89 TP53 (0.85) TP53CYP3A4ALDH1A1TSHRMAPK1
SCHEMBL1644180 0.84 TP53 (0.65) TP53CYP3A4ALDH1A1MGLL
SCHEMBL18428568 0.83 TP53 (0.74) TP53CYP3A4ALDH1A1TSHRLMNA
SCHEMBL1045748 0.83 TP53 (0.74) TP53CYP3A4ALDH1A1TSHRLMNA
SCHEMBL14550604 0.82 TP53 (0.73) TP53CYP3A4ALDH1A1TSHRLMNA
SCHEMBL8728323 0.82 TP53 (1.00) TP53CYP3A4ALDH1A1TSHRLMNA
SCHEMBL124728 0.82 TP53 (1.00) TP53CYP3A4ALDH1A1TSHRLMNA
SCHEMBL18513488 0.82 TP53 (1.00) TP53CYP3A4ALDH1A1TSHRLMNA
SCHEMBL8733512 0.82 TP53 (1.00) TP53CYP3A4ALDH1A1TSHRLMNA

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 115 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20240076488-A1 ELECTRICALLY CONDUCTIVE COMPOSITIONS CAPABLE OF SINTERING HENKEL AG & CO KGAA (DE) 2024-03-07 US claimed
CN-117222702-A Conductive composition capable of being sintered 汉高股份有限及两合公司 2023-12-12 CN claimed
WO-2022232548-A1 ELECTRICALLY CONDUCTIVE COMPOSITIONS CAPABLE OF SINTERING Henkel IP & Holding GmbH (DE) 2022-11-03 WO claimed
CN-108350150-B Epoxy resin composition 亨斯迈先进材料许可(瑞士)有限公司 2021-09-10 CN claimed
EP-3310838-B1 EPOXY RESIN COMPOSITION HUNTSMAN ADV MAT LICENSING SWITZERLAND GMBH (CH) 2021-08-18 EP claimed
US-20210115246-A1 Curable Mixtures for Use in Impregnation of Paper Bushings HUNTSMAN ADVANCED MATERIALS LICENSING (SWITZERLAND) GMBH (CH) 2021-04-22 US claimed
EP-3766085-A1 CURABLE MIXTURES FOR USE IN IMPREGNATION OF PAPER BUSHINGS Huntsman Advanced Materials Licensing (Switzerland) GmbH (CH) 2021-01-20 EP claimed
CN-111868844-A Curable mixture for impregnating paper sleeves 亨斯迈先进材料许可(瑞士)有限公司 2020-10-30 CN claimed
WO-2019175338-A1 CURABLE MIXTURES FOR USE IN IMPREGNATION OF PAPER BUSHINGS HUNTSMAN ADVANCED MATERIALS LICENSING (SWITZERLAND) GMBH (CH) 2019-09-19 WO claimed
US-20190057792-A1 ELECTRICALLY CONDUCTIVE COMPOSITION AND APPLICATIONS FOR SAID COMPOSITION HENKEL AG & CO KGAA (DE) 2019-02-21 US claimed
EP-3420023-A1 ELECTRICALLY CONDUCTIVE COMPOSITION AND APPLICATIONS FOR SAID COMPOSITION Henkel AG & Co. KGaA (DE) 2019-01-02 EP claimed
US-20180171101-A1 Epoxy Resin Composition HUNTSMAN INTERNATIONAL LLC 2018-06-21 US claimed
EP-3310838-A1 EPOXY RESIN COMPOSITION Huntsman Advanced Materials Licensing (Switzerland) GmbH (CH) 2018-04-25 EP claimed
WO-2017143901-A1 ELECTRICALLY CONDUCTIVE COMPOSITION AND APPLICATIONS FOR SAID COMPOSITION HENKEL AG & CO. KGAA (DE) 2017-08-31 WO claimed
WO-2016202608-A1 EPOXY RESIN COMPOSITION HUNTSMAN ADVANCED MATERIALS (SWITZERLAND) GMBH (CH) 2016-12-22 WO claimed
US-6638567-B1 Cycloaliphatic epoxy resin liquid at room temperature suspended in core/shell polymer; polycarboxylic anhydride and fillers; fireproof VANTICO, INC. 2003-10-28 US claimed
EP-3559073-B1 LATENT CURING ACCELERATORS HUNTSMAN ADV MAT SWITZERLAND (CH) 2026-04-08 EP disclosed
US-12516188-B2 Storage stable and curable resin compositions HUNTSMAN ADVANCED MATERIALS (US) 2026-01-06 US disclosed
US-4038338-A NEW POLYEPOXIDE-POLYSILOXANE COMPOUNDS CIBA-GEIGY CORPORATION (US) 1977-07-26 US disclosed
US-3954712-A Hot-curable mixtures based on epoxide resin CIBA-GEIGY CORPORATION (US) 1976-05-04 US disclosed