⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL29086318 | 0.87 | — | — | |
| SCHEMBL6933322 | 0.80 | — | — | |
| SCHEMBL9550763 | 0.77 | — | — | |
| SCHEMBL28586993 | 0.76 | — | — | |
| SCHEMBL7916836 | 0.76 | — | — | |
| SCHEMBL2397050 | 0.73 | — | — | |
| SCHEMBL3797389 | 0.71 | — | — | |
| SCHEMBL28939437 | 0.70 | SCN2A (0.31) | — | |
| SCHEMBL2465421 | 0.69 | SCN2A (0.33) | — | |
| SCHEMBL28807732 | 0.69 | SCN2A (0.33) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-110734736-B | Adhesive for temporary bonding, adhesive layer, wafer processed body, and method for manufacturing semiconductor device using same | 东丽株式会社 | 2022-04-19 | — | — | CN | disclosed |
| CN-108603028-B | Resin composition, resin layer, temporary adhesive, laminated film, wafer processed body, and application thereof | 东丽株式会社 | 2021-05-07 | — | — | CN | disclosed |
| CN-108138013-B | Laminate film for temporary bonding, substrate-processed body using laminate film for temporary bonding, method for manufacturing laminated substrate-processed body, and method for manufacturing semiconductor device using same | 东丽株式会社 | 2021-02-19 | — | — | CN | disclosed |