Ethane

Ethane

SCHEMBL28540970

C1=Cc2ccccc2ON1.CC

nearest known ligand 0.34

Full drug profile on Sugi Atlas →

Predicted protein targets (top 9)

geneUniProtsupporting neighboursconfidence
MAPT P10636 2/20 0.34
GAA P10253 1/20 0.34
KDM4E B2RXH2 1/20 0.33
MEN1 O00255 1/20 0.33
ALDH1A1 P00352 1/20 0.33
KMT2A Q03164 1/20 0.33
HTR2C P28335 1/20 0.33
HTR2B P41595 1/20 0.33
PARP1 P09874 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL16341187 0.96 MAPT (0.37) MAPTGAAKDM4EMEN1ALDH1A1
SCHEMBL29804885 0.96 MAPT (0.37) MAPTGAAKDM4EMEN1ALDH1A1
SCHEMBL8924 0.96 MAPT (0.37) MAPTGAAKDM4EMEN1ALDH1A1
SCHEMBL3662203 0.96 MAPT (0.37) MAPTGAAKDM4EMEN1ALDH1A1
Methyl Alcohol SCHEMBL28243297 0.94 MAPT (0.33) MAPTGAAKDM4EMEN1ALDH1A1
Methylamine SCHEMBL6415767 0.94 MAPT (0.36) MAPTGAAKDM4EMEN1ALDH1A1
SCHEMBL7679307 0.93 MAPT (0.36) MAPTGAAKDM4EMEN1ALDH1A1
SCHEMBL7679297 0.93 MAPT (0.36) MAPTGAAKDM4EMEN1ALDH1A1
Methane SCHEMBL17891768 0.93 MAPT (0.36) MAPTGAAKDM4EMEN1ALDH1A1
SCHEMBL3201327 0.93 MAPT (0.36) MAPTGAAKDM4EMEN1ALDH1A1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 7 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-117924932-A Resin composition, prepreg, method for producing the same, and laminate and method for producing the same 广东盈骅新材料科技有限公司 2024-04-26 CN claimed
CN-117887209-A Resin composition, build-up film, preparation method of build-up film and packaging carrier plate 清华珠三角研究院 2024-04-16 CN claimed
CN-117844175-A Resin composition with low thermal expansion coefficient and application thereof 清华珠三角研究院 2024-04-09 CN claimed
CN-117844183-A Low dielectric resin composition and application thereof 清华珠三角研究院 2024-04-09 CN claimed
CN-112724867-B Insulating adhesive film material and preparation method and application thereof 深圳先进技术研究院 2023-01-10 CN disclosed
CN-112724867-A Insulating adhesive film material and preparation method and application thereof 深圳先进技术研究院 2021-04-30 CN disclosed
CN-112662334-A Low-thermal expansion coefficient insulating adhesive film and preparation method thereof 中国科学院深圳先进技术研究院 2021-04-16 CN disclosed