SCHEMBL28544676

SCHEMBL28544676

CCCCCCCC/C=C\CCCCCCC[CH]OCCOCCO

nearest known ligand 0.63

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
MAPT P10636 3/20 0.56
KMT2A Q03164 2/20 0.56
MEN1 O00255 1/20 0.56
THRB P10828 1/20 0.56
HTT P42858 1/20 0.56
EPHX2 P34913 1/20 0.50
TSHR P16473 1/20 0.47
CNR2 P34972 1/20 0.47
TRPV1 Q8NER1 1/20 0.47
MGLL Q99685 1/20 0.44
TERT O14746 3/20 0.43
BLM P54132 2/20 0.43
HSD17B10 Q99714 2/20 0.43
FABP4 P15090 2/20 0.43
PTPN1 P18031 2/20 0.43
PPARG P37231 2/20 0.43
PPARD Q03181 2/20 0.43
PPARA Q07869 2/20 0.43
GMNN O75496 1/20 0.43
USP2 O75604 1/20 0.43

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL27577975 0.95 MEN1 (0.62) MAPTKMT2AMEN1THRBHTT
SCHEMBL8580710 0.95 MEN1 (0.62) MAPTKMT2AMEN1THRBHTT
SCHEMBL22500203 0.90 CNR2 (0.51) MAPTKMT2ACNR2TRPV1MGLL
SCHEMBL5144695 0.89 MEN1 (0.69) MAPTKMT2AMEN1THRBHTT
SCHEMBL28054454 0.88 TSHR (0.56) MAPTKMT2AMEN1THRBHTT
SCHEMBL11594173 0.86 MEN1 (0.77) MAPTKMT2AMEN1THRBHTT
SCHEMBL381638 0.86 MEN1 (0.77) MAPTKMT2AMEN1THRBHTT
SCHEMBL6554473 0.86 MEN1 (0.77) MAPTKMT2AMEN1THRBHTT
SCHEMBL2123908 0.86 MEN1 (0.77) MAPTKMT2AMEN1THRBHTT
SCHEMBL965023 0.86 MEN1 (0.77) MAPTKMT2AMEN1THRBHTT

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-106867411-B Slurry composition for chemical mechanical polishing, method for producing the same, polishing method, method for manufacturing semiconductor device, and polishing apparatus 三星电子株式会社 2021-04-06 CN disclosed