SCHEMBL28545453

SCHEMBL28545453

CCCCC(CC)(CCCC)C(=O)OO

nearest known ligand 0.44

Predicted protein targets (top 13)

geneUniProtsupporting neighboursconfidence
CYP4F2 P78329 1/20 0.44
CYP4A11 Q02928 1/20 0.44
FDPS P14324 1/20 0.33
MEN1 O00255 1/20 0.33
MAPT P10636 1/20 0.33
KMT2A Q03164 1/20 0.33
ATM Q13315 1/20 0.33
L3MBTL1 Q9Y468 1/20 0.33
EPHX1 P07099 5/20 0.32
CES2 O00748 4/20 0.32
ALDH1A1 P00352 1/20 0.32
CES1 P23141 2/20 0.32
PAM P19021 2/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL27519808 0.96 CYP4F2 (0.48) CYP4F2CYP4A11FDPSMEN1MAPT
SCHEMBL1734680 0.92 CYP4F2 (0.46) CYP4F2CYP4A11FDPSMEN1MAPT
SCHEMBL27614308 0.91 CYP4F2 (0.38) CYP4F2CYP4A11FDPSMEN1MAPT
SCHEMBL247768 0.83 CES2 (0.44) CYP4F2CYP4A11FDPSMEN1MAPT
SCHEMBL28343512 0.82 CYP4F2 (0.37) CYP4F2CYP4A11FDPSMEN1MAPT
SCHEMBL15820331 0.81 CYP4F2 (0.35) CYP4F2CYP4A11FDPSMEN1MAPT
SCHEMBL5342373 0.80 CYP4F2 (0.50) CYP4F2CYP4A11FDPSMEN1MAPT
SCHEMBL15501215 0.80 CYP4F2 (0.46) CYP4F2CYP4A11
SCHEMBL15295458 0.79 CYP4F2 (0.42) CYP4F2CYP4A11FDPSMEN1MAPT
SCHEMBL29149655 0.79 CYP4F2 (0.50) CYP4F2CYP4A11ATML3MBTL1EPHX1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-108250716-B Polysiloxane-allyl compound modified polyphenyl ether resin composition, and prepreg, laminated board and printed circuit board thereof 广东生益科技股份有限公司 2021-07-06 CN disclosed
CN-108250605-B Polysiloxane-allyl compound modified polybutadiene resin composition, and prepreg, laminated board and printed circuit board thereof 广东生益科技股份有限公司 2021-04-02 CN disclosed