SCHEMBL28569037

SCHEMBL28569037

CN(c1ccc(OC#N)cc1)c1ncncn1

nearest known ligand 0.33

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
KDM4C Q9H3R0 1/20 0.32
PDGFRB P09619 5/20 0.32
KDR P35968 5/20 0.32
EGFR P00533 4/20 0.32
PDGFRA P16234 3/20 0.32
TUBB4A P04350 1/20 0.31
TUBB P07437 1/20 0.31
TUBA3C P0DPH7 1/20 0.31
TUBA1B P68363 1/20 0.31
TUBA4A P68366 1/20 0.31
TUBB4B P68371 1/20 0.31
TUBB3 Q13509 1/20 0.31
TUBB2A Q13885 1/20 0.31
TUBB8 Q3ZCM7 1/20 0.31
TUBA3E Q6PEY2 1/20 0.31
TUBA1A Q71U36 1/20 0.31
TUBA1C Q9BQE3 1/20 0.31
TUBB6 Q9BUF5 1/20 0.31
TUBB2B Q9BVA1 1/20 0.31
TUBB1 Q9H4B7 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL17042373 0.83 MERTK (0.38) KDM4CPDGFRBKDREGFRPDGFRA
SCHEMBL21462938 0.82 CSF1R (0.39) PDGFRBKDREGFRPDGFRAMERTK
SCHEMBL8985411 0.80 ALDH1A1 (0.33) KDM4CPDGFRBKDREGFRPDGFRA
SCHEMBL13367667 0.80 EGFR (0.46) PDGFRBKDREGFRPDGFRATUBB4A
SCHEMBL29038976 0.78 ABCG2 (0.40) KDM4C
SCHEMBL17042548 0.77 MERTK (0.44) PDGFRBKDREGFRMERTK
SCHEMBL795930 0.71 EGFR (0.46) PDGFRBEGFRPDGFRA
SCHEMBL13367500 0.69 MAPK1 (0.40) EGFR
SCHEMBL13367381 0.67 HSP90AA1 (0.38) EGFR
SCHEMBL24787 0.67 CA1 (0.32)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 9 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-117222682-A Cured resin composition and cured product thereof 日本化药株式会社 2023-12-12 CN disclosed
CN-116940617-A Resin composition, resin sheet, multilayer printed wiring board, and semiconductor device 日本化药株式会社 2023-10-24 CN disclosed
CN-116888189-A Thermosetting resin composition, cured product, resin sheet, prepreg, metal foil-clad laminate, multilayer printed wiring board, sealing material, fiber-reinforced composite material, adhesive, and semiconductor device 日本化药株式会社 2023-10-13 CN disclosed
CN-116813824-A Resin composition, resin sheet, multilayer printed wiring board, and semiconductor device 三菱瓦斯化学株式会社 2023-09-29 CN disclosed
CN-116829619-A Resin composition, cured product, resin sheet, prepreg, metal foil-clad laminate, multilayer printed wiring board, sealing material, fiber-reinforced composite material, adhesive, and semiconductor device 日本化药株式会社 2023-09-29 CN disclosed
CN-113348079-B Resin composition, resin sheet, multilayer printed wiring board, and semiconductor device 三菱瓦斯化学株式会社 2023-06-02 CN disclosed
CN-110198968-B Resin composition, prepreg, metal foil-clad laminate, resin sheet, and printed wiring board 三菱瓦斯化学株式会社 2022-06-21 CN disclosed
CN-110869409-B Resin composition, prepreg, metal foil-clad laminate, resin sheet, and printed wiring board 三菱瓦斯化学株式会社 2022-05-31 CN disclosed
CN-112204105-A Resin composition, prepreg, metal foil-clad laminate, resin sheet, and printed wiring board 三菱瓦斯化学株式会社 2021-01-08 CN disclosed