SCHEMBL2858501

SCHEMBL2858501

CCCCOCC(OCCCC)(OCCCC)OP(OC(COCCCC)(OCCCC)OCCCC)OC(COCCCC)(OCCCC)OCCCC

nearest known ligand 0.35

Predicted protein targets (top 8)

geneUniProtsupporting neighboursconfidence
TSHR P16473 2/20 0.35
CES1 P23141 1/20 0.35
CYP3A4 P08684 1/20 0.31
SMN1; SMN2 Q16637 2/20 0.31
HPGD P15428 1/20 0.31
ADRB2 P07550 1/20 0.30
ADRB1 P08588 1/20 0.30
ADRB3 P13945 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL4145527 0.85 TSHR (0.42) TSHRCES1CYP3A4SMN1; SMN2HPGD
SCHEMBL751240 0.85 TSHR (0.38) TSHRCES1
SCHEMBL855728 0.79 TSHR (0.38) TSHRCES1CYP3A4SMN1; SMN2HPGD
SCHEMBL7591304 0.79 CES1 (0.48) TSHRCES1
SCHEMBL11799377 0.78 CES1 (0.46) TSHRCES1
SCHEMBL11799813 0.78 CES1 (0.46) TSHRCES1
SCHEMBL37202 0.74 CYP3A4 (0.47) TSHRCES1CYP3A4SMN1; SMN2HPGD
SCHEMBL430961 0.74 TSHR (0.34) TSHRCES1CYP3A4
SCHEMBL15809387 0.74 TSHR (0.41) TSHRCES1CYP3A4SMN1; SMN2HPGD
SCHEMBL9239969 0.73 CES1 (0.37) TSHRCES1CYP3A4SMN1; SMN2HPGD

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 60 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-1618173-A1 LUBRICANT COMPOSITIONS Great Lakes Chemical (Europe) GmbH (CH) 2006-01-25 EP claimed
WO-2004096959-A1 LUBRICANT COMPOSITIONS GREAT LAKES CHEMICAL (EUROPE) GMBH (CH) 2004-11-11 WO claimed
US-20250353945-A1 REACTIVE RESINS BASED ON ETHYL METHACRYLATE RÖHM GMBH (DE) 2025-11-20 US disclosed
US-20250250443-A1 COATING COMPOSITIONS HAVING IMPROVED CORROSION RESISTANCE PPG INDUSTRIES OHIO, INC. (US) 2025-08-07 US disclosed
US-20250188287-A1 MULTI-LAYERED COATED METAL SUBSTRATES PRC-DESOTO INTERNATIONAL, INC. (US) 2025-06-12 US disclosed
US-20250179285-A1 TERMINALLY UNSATURATED (METH)ACRYLATE CROSSLINKERS AND USE THEREOF RÖHM GMBH (DE) 2025-06-05 US disclosed
US-12319835-B2 Coating compositions having improved corrosion resistance PPG INDUSTRIES OHIO, INC. (US) 2025-06-03 US disclosed
EP-4486833-A2 MULTI-LAYERED COATED METAL SUBSTRATES PRC-Desoto International, Inc. (US) 2025-01-08 EP disclosed
CN-119213045-A Terminally unsaturated (meth) acrylate crosslinkers and their use 罗姆化学有限责任公司 2024-12-27 CN disclosed
CN-115916895-B Curing reaction resins using unsaturated peroxides as initiators and organic phosphites as accelerators 罗姆化学有限责任公司 2024-10-29 CN disclosed
CN-118546635-A LED packaging adhesive, preparation method and LED packaging method 北京康美特科技股份有限公司 2024-08-27 CN disclosed
EP-0174373-B1 PROCESS FOR PRODUCING HEAT-RESISTANT RESIN MOLDINGS HAVING EXCELLENT ABRASION RESISTANCE MITSUBISHI RAYON CO., LTD. (JP) 1989-08-02 EP disclosed
US-4745159-A Methacrylate resin composition and process for its preparation MITSUBISHI RAYON CO., LTD. (JP) 1988-05-17 US disclosed
US-4737409-A Heat-resistant resin molded article with excellent abrasion resistance and process for producing the same MITSUBISHI RAYON CO., LTD. (JP) 1988-04-12 US disclosed
US-4693553-A Light-transmitting fiber MITSUBISHI RAYON COMPANY LTD. (JP) 1987-09-15 US disclosed
EP-0234726-A2 Methacrylate resin composition and process for its preparation MITSUBISHI RAYON CO., LTD. (JP) 1987-09-02 EP disclosed
US-4689243-A A POLYDIMETHYLGLUTARIMIDE RESIN COATED WITH A CURED RESIN OF POLY(METH)ACRYLOYLOXY-GROUP CONTAINING MONOMER MITSUBISHI RAYON CO., LTD. (JP) 1987-08-25 US disclosed
EP-0174373-A1 PROCESS FOR PRODUCING HEAT-RESISTANT RESIN MOLDINGS HAVING EXCELLENT ABRASION RESISTANCE MITSUBISHI RAYON CO., LTD. (JP) 1986-03-19 EP disclosed
EP-0155567-A2 Light-transmitting fiber MITSUBISHI RAYON CO., LTD. (JP) 1985-09-25 EP disclosed
US-4352899-A EPOXY RESIN, ORGANIC PHOSPHORUS COMPOUND, ZINC POWDER, MAGNESIUM COMPOUND SAKAI CHEMICAL INDUSTRY CO., LTD. (JP) 1982-10-05 US disclosed