SCHEMBL28594

SCHEMBL28594

CC(O)(CO)CCO

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL7117446 0.91 ALDH1A1 (0.33)
SCHEMBL184709 0.86
SCHEMBL20395071 0.83 DPP4 (0.32)
SCHEMBL268997 0.81
SCHEMBL9578134 0.81 ALDH1A1 (0.35)
SCHEMBL17867660 0.81 ALDH1A1 (0.35)
SCHEMBL10430842 0.81
Methylamine SCHEMBL28435419 0.80 ALDH1A1 (0.39)
SCHEMBL283797 0.78
SCHEMBL14224578 0.78 ALDH1A1 (0.37)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Appears in 3339 patents — a generic fragment claimed broadly, so it's down-weighted as IP noise. Top by claim status then date:

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-3527624-B1 POLYOXYMETHYLENE RESIN COMPOSITION KOREA ENG PLASTICS CO LTD (KR) 2025-11-26 EP claimed
US-12454597-B2 Polyester resin MITSUBISHI CHEMICAL CORPORATION (JP) 2025-10-28 US claimed
WO-2025064521-A1 ULTRAFILTRATION / DIAFILTRATION PURIFICATION METHODS PROFOUNDBIO US CO. (US) 2025-03-27 WO claimed
EP-4454805-A2 FLUX, SOLDER PASTE, AND METHOD OF PRODUCING JOINED BODY Senju Metal Industry Co., Ltd. (JP) 2024-10-30 EP claimed
CN-118832338-A Soldering flux, solder paste, and method for producing joined body 千住金属工业株式会社 2024-10-25 CN claimed
US-20240351148-A1 FLUX, SOLDER PASTE, AND METHOD OF PRODUCING JOINED BODY SENJU METAL INDUSTRY CO., LTD. (JP) 2024-10-24 US claimed
US-11866577-B2 Additive manufacturing compositions and methods Polynt Composites USA, Inc. (US) 2024-01-09 US claimed
WO-2022065690-A1 POLYESTER INCLUDING COMPONENT DERIVED FROM BIOMASS AND METHOD FOR PREPARING SAME 코오롱인더스트리 주식회사 2022-03-31 WO claimed
CN-109863204-B Polyoxymethylene resin composition 韩国工程塑科株式会社 2021-09-03 CN claimed
US-11028263-B2 Polyoxymethylene resin composition KOREA ENGINEERING PLASTICS CO., LTD. (KR) 2021-06-08 US claimed
US-5380614-A Color particles and binder resins with charge control agent such as alumina TOMOEGAWA PAPER CO., LTD. (JP) 1995-01-10 US claimed
US-5234787-A Linear and nonlinear polyester binder resins and colorant KAO CORPORATION (JP) 1993-08-10 US claimed
EP-0464829-A1 Developer composition for electrophotography Kao Corporation (JP) 1992-01-08 EP claimed
EP-0164257-B1 TONER FOR DEVELOPING ELECTROSTATIC LATENT IMAGE KONICA CORPORATION (JP) 1991-04-17 EP claimed
US-4933252-A Toners KAO CORPORATION (JP) 1990-06-12 US claimed
US-4917983-A Toner for developing an electrostatic latent image comprising linear polyester polymer KONISHIROKU PHOTO INDUSTRY CO., LTD. (JP) 1990-04-17 US claimed
US-4877704-A WITH ALKYLENE-BIS-ALIPHATIC ACID AMIDE AND WAX; LOW TEMPERATURE FIXABILITY, STABILITY KONISHIROKU PHOTO INDUSTRY CO., LTD. (JP) 1989-10-31 US claimed
US-4804622-A POLYESTER BINDER KAO CORPORATION (JP) 1989-02-14 US claimed
US-4693952-A POLYESTER, EPOXY RESIN KONISHIROKU PHOTO INDUSTRY CO., LTD. 1987-09-15 US claimed
US-4579802-A APPLYING AN AGENT FOR IMPROVING ELASTICITY TO PREVENT BACK CONTAMINATION KONISHIROKU PHOTO INDUSTRY CO. LTD. (JP) 1986-04-01 US claimed