⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL28392488 | 0.82 | — | — | |
| SCHEMBL3450815 | 0.69 | — | — | |
| SCHEMBL28557702 | 0.64 | — | — | |
| SCHEMBL306180 | 0.62 | — | — | |
| SCHEMBL71521 | 0.61 | TSHR (0.30) | — | |
| SCHEMBL25265058 | 0.59 | — | — | |
| SCHEMBL5833656 | 0.59 | — | — | |
| SCHEMBL21808398 | 0.59 | — | — | |
| SCHEMBL3655426 | 0.58 | TSHR (0.32) | — | |
| SCHEMBL302687 | 0.58 | TSHR (0.32) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-113637329-B | High-biocompatibility photosensitive organic silicon material, preparation method thereof and application thereof in photocuring 3D printing | 广东工业大学 | 2022-06-14 | — | — | CN | claimed |
| CN-113150694-A | Chemical mechanical polishing slurry composition and method for polishing tungsten pattern wafer using the same | 三星SDI株式会社 | 2021-07-23 | — | — | CN | claimed |
| CN-113969106-B | Chemical mechanical polishing slurry composition and method for polishing tungsten pattern wafer using the same | 三星SDI株式会社 | 2023-04-07 | — | — | CN | disclosed |
| CN-113969106-A | Chemical mechanical polishing slurry composition and method for polishing tungsten pattern wafer using the same | 三星SDI株式会社 | 2022-01-25 | — | — | CN | disclosed |