SCHEMBL28606802

SCHEMBL28606802

CC(C)CCCCC(=O)OCCOCCO

nearest known ligand 0.47

Predicted protein targets (top 18)

geneUniProtsupporting neighboursconfidence
EPHX2 P34913 2/20 0.47
DGKA P23743 1/20 0.46
MGLL Q99685 1/20 0.38
MEN1 O00255 3/20 0.37
KMT2A Q03164 3/20 0.37
MAPT P10636 2/20 0.37
TSHR P16473 2/20 0.36
DNM1 Q05193 1/20 0.36
CYP3A4 P08684 1/20 0.36
ATM Q13315 1/20 0.36
TDP1 Q9NUW8 1/20 0.36
ALDH1A1 P00352 1/20 0.35
L3MBTL1 Q9Y468 1/20 0.35
THRB P10828 1/20 0.35
HTT P42858 1/20 0.35
KDM4E B2RXH2 1/20 0.35
DUSP3 P51452 1/20 0.35
LMNA P02545 1/20 0.35

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL28377219 1.00 EPHX2 (0.47) EPHX2DGKAMGLLMEN1KMT2A
SCHEMBL29359233 0.98 EPHX2 (0.49) EPHX2DGKAMGLLMEN1KMT2A
Triethylene Glycol SCHEMBL29106630 0.94 EPHX2 (0.45) EPHX2DGKAMEN1KMT2AMAPT
Di(Hydroxyethyl)Ether SCHEMBL28589497 0.92 DGKA (0.44) EPHX2DGKAMEN1KMT2AMAPT
SCHEMBL6061688 0.91 DGKA (0.55) EPHX2DGKAMAPTTSHRDNM1
SCHEMBL769549 0.91 DGKA (0.55) EPHX2DGKAMAPTTSHRDNM1
SCHEMBL28835957 0.91 DGKA (0.55) EPHX2DGKAMAPTTSHRDNM1
SCHEMBL34109 0.91 DGKA (0.55) EPHX2DGKAMAPTTSHRDNM1
SCHEMBL29861229 0.91 DGKA (0.55) EPHX2DGKAMAPTTSHRDNM1
SCHEMBL433535 0.90 DGKA (0.47) DGKAMGLLMEN1KMT2AMAPT

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-113144679-B Metallographic cold-inlaid high-transparency epoxy resin defoaming agent and application thereof 烟台大学 2022-04-26 CN claimed
CN-113144679-A Metallographic cold-inlaid high-transparency epoxy resin defoaming agent and application thereof 烟台大学 2021-07-23 CN claimed
CN-113144679-B Metallographic cold-inlaid high-transparency epoxy resin defoaming agent and application thereof 烟台大学 2022-04-26 CN disclosed
CN-113144679-A Metallographic cold-inlaid high-transparency epoxy resin defoaming agent and application thereof 烟台大学 2021-07-23 CN disclosed