SCHEMBL28612684

SCHEMBL28612684

[N-]=[N+]=C(S(=O)(=O)O)S(=O)(=O)O

nearest known ligand 0.33

Predicted protein targets (top 2)

geneUniProtsupporting neighboursconfidence
CA5A P35218 1/20 0.33
CA5B Q9Y2D0 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL7897552 0.69
Sulfuric Acid SCHEMBL2840688 0.68
SCHEMBL10553359 0.67
Sulfuric Acid SCHEMBL28642679 0.65 CA5A (0.55) CA5ACA5B
Sulfuric Acid SCHEMBL3650810 0.65 CA5A (0.55) CA5ACA5B
SCHEMBL491009 0.65
Sulfuric Acid SCHEMBL16448274 0.65 CA5A (0.55) CA5ACA5B
Sulfuric Acid SCHEMBL28937744 0.62
SCHEMBL5632653 0.62
Sulfuric Acid SCHEMBL9621807 0.57

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 8 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-113314402-B Photoresist composition and method for manufacturing semiconductor device 台湾积体电路制造股份有限公司 2025-03-25 CN disclosed
CN-113311661-B Photoresist underlayer composition and method for manufacturing semiconductor device 台湾积体电路制造股份有限公司 2024-10-15 CN disclosed
CN-109791359-B Resist composition, method for forming resist pattern, polymer compound and copolymer 东京应化工业株式会社 2022-10-11 CN disclosed
CN-108693703-B Resist composition and resist pattern formation method 东京应化工业株式会社 2022-09-23 CN disclosed
CN-115087928-A Resist pattern forming method 东京应化工业株式会社 2022-09-20 CN disclosed
CN-113311661-A Photoresist underlayer composition and method for manufacturing semiconductor device 台湾积体电路制造股份有限公司 2021-08-27 CN disclosed
CN-113314402-A Photoresist composition and method for manufacturing semiconductor device 台湾积体电路制造股份有限公司 2021-08-27 CN disclosed
CN-113311662-A Method for manufacturing semiconductor device and photoresist composition 台湾积体电路制造股份有限公司 2021-08-27 CN disclosed