⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL4920070 | 0.77 | CYP2D6 (0.44) | — | |
| SCHEMBL12353689 | 0.74 | TDP1 (0.43) | — | |
| SCHEMBL3623632 | 0.73 | — | — | |
| SCHEMBL5757035 | 0.71 | ACACB (0.30) | — | |
| SCHEMBL6049833 | 0.68 | — | — | |
| SCHEMBL12394785 | 0.68 | ALDH1A1 (0.39) | — | |
| SCHEMBL3123040 | 0.67 | — | — | |
| SCHEMBL446980 | 0.67 | — | — | |
| SCHEMBL22089484 | 0.67 | — | — | |
| SCHEMBL29196122 | 0.67 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 11 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-114952074-A | High-stability and antioxidant solder paste | 深圳市鑫富锦新材料有限公司 | 2022-08-30 | — | — | CN | claimed |
| CN-113441868-A | Lead-free antioxidant tin paste with good wetting effect and preparation method thereof | 中山翰华锡业有限公司 | 2021-09-28 | — | — | CN | claimed |
| CN-109955001-B | Lead-free antioxidant solder paste and preparation method thereof | 中山翰华锡业有限公司 | 2021-08-13 | — | — | CN | claimed |
| CN-114952074-A | High-stability and antioxidant solder paste | 深圳市鑫富锦新材料有限公司 | 2022-08-30 | — | — | CN | disclosed |
| CN-113441868-B | Lead-free antioxidant tin paste with good wetting effect and preparation method thereof | 中山翰华锡业有限公司 | 2022-06-14 | — | — | CN | disclosed |
| CN-113441867-B | Halogen-free lead-free antioxidant solder paste and preparation method thereof | 中山翰华锡业有限公司 | 2022-06-14 | — | — | CN | disclosed |
| CN-113441868-B | Lead-free antioxidant tin paste with good wetting effect and preparation method thereof | 中山翰华锡业有限公司 | 2022-06-14 | — | — | CN | disclosed |
| CN-113441868-A | Lead-free antioxidant tin paste with good wetting effect and preparation method thereof | 中山翰华锡业有限公司 | 2021-09-28 | — | — | CN | disclosed |
| CN-113441868-A | Lead-free antioxidant tin paste with good wetting effect and preparation method thereof | 中山翰华锡业有限公司 | 2021-09-28 | — | — | CN | disclosed |
| CN-113441867-A | Halogen-free lead-free antioxidant solder paste and preparation method thereof | 中山翰华锡业有限公司 | 2021-09-28 | — | — | CN | disclosed |
| CN-109955001-B | Lead-free antioxidant solder paste and preparation method thereof | 中山翰华锡业有限公司 | 2021-08-13 | — | — | CN | disclosed |