⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL28641920 | 0.87 | — | — | |
| Water SCHEMBL23832327 | 0.87 | — | — | |
| SCHEMBL27866461 | 0.87 | — | — | |
| Hydrogen Sulfide SCHEMBL20540913 | 0.87 | — | — | |
| SCHEMBL27906033 | 0.82 | — | — | |
| SCHEMBL901165 | 0.82 | — | — | |
| SCHEMBL30275025 | 0.82 | — | — | |
| SCHEMBL841508 | 0.82 | — | — | |
| SCHEMBL295063 | 0.67 | — | — | |
| SCHEMBL9318964 | 0.67 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-215887274-U | Alloy electroplating device | 梧州三和新材料科技有限公司 | 2022-02-22 | — | — | CN | disclosed |
| CN-113430626-A | Alloy electroplating device | 梧州三和新材料科技有限公司 | 2021-09-24 | — | — | CN | disclosed |