SCHEMBL28630660

SCHEMBL28630660

CCCCCCCCCCCCCCCCCCC(C)O[Si](OCC)(OCC)OCC

nearest known ligand 0.41

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
OPRM1 P35372 1/20 0.41
FAAH O00519 5/20 0.38
CNR1 P21554 1/20 0.37
CNR2 P34972 1/20 0.37
SPHK1 Q9NYA1 1/20 0.35
LMNA P02545 1/20 0.34
TP53 P04637 1/20 0.34
ADH1B P00325 1/20 0.33
ADH1C P00326 1/20 0.33
ADH1A P07327 1/20 0.33
ADH4 P08319 1/20 0.33
ADH7 P40394 1/20 0.33
ALDH1A1 P00352 1/20 0.33
DNM1 Q05193 1/20 0.33
PSMD14 O00487 1/20 0.33
PLA2G1B P04054 1/20 0.33
MMP2 P08253 1/20 0.33
RAD52 P43351 1/20 0.33
ATG4B Q9Y4P1 1/20 0.33
SMPD1 P17405 3/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL26643025 1.00 OPRM1 (0.41) OPRM1FAAHCNR1CNR2SPHK1
SCHEMBL16144947 0.87 OPRM1 (0.42) OPRM1FAAHCNR1CNR2SPHK1
SCHEMBL16144954 0.87 OPRM1 (0.42) OPRM1FAAHCNR1CNR2SPHK1
SCHEMBL11522607 0.83
SCHEMBL28497703 0.82 OPRM1 (0.40) OPRM1FAAHCNR1CNR2SPHK1
SCHEMBL7890010 0.82 OPRM1 (0.40) OPRM1FAAHCNR1CNR2SPHK1
SCHEMBL30662145 0.82 OPRM1 (0.40) OPRM1FAAHCNR1CNR2SPHK1
SCHEMBL31529685 0.82 OPRM1 (0.40) OPRM1FAAHCNR1CNR2SPHK1
SCHEMBL30662146 0.82 OPRM1 (0.40) OPRM1FAAHCNR1CNR2SPHK1
SCHEMBL3403631 0.82 OPRM1 (0.40) OPRM1FAAHCNR1CNR2SPHK1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-113336536-B Hydrogel material assembled by inorganic non-metal nanoparticles and application of hydrogel material in additive manufacturing technology 大连理工大学 2022-11-15 CN disclosed
CN-113336536-A Hydrogel material assembled by inorganic non-metal nanoparticles and application of hydrogel material in additive manufacturing technology 大连理工大学 2021-09-03 CN disclosed