Butyl Alcohol

Butyl Alcohol

SCHEMBL28636904

CCCCO.CCCCO.[Ti]

nearest known ligand 0.92

Full drug profile on Sugi Atlas →

Predicted protein targets (top 11)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 2/20 0.92
SMN1; SMN2 Q16637 1/20 0.71
TSHR P16473 4/20 0.67
LMNA P02545 3/20 0.67
MEN1 O00255 3/20 0.67
KMT2A Q03164 3/20 0.67
HSD17B10 Q99714 1/20 0.67
THRB P10828 2/20 0.43
DNM1 Q05193 4/20 0.39
HTT P42858 1/20 0.39
MAPT P10636 1/20 0.39

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Butyl Alcohol SCHEMBL7028948 1.00 ALDH1A1 (0.92) ALDH1A1SMN1; SMN2TSHRLMNAMEN1
Butyl Alcohol SCHEMBL1305605 1.00
Butyl Alcohol SCHEMBL29044530 1.00 ALDH1A1 (0.92) ALDH1A1SMN1; SMN2TSHRLMNAMEN1
Butyl Alcohol SCHEMBL1193596 1.00 ALDH1A1 (0.92) ALDH1A1SMN1; SMN2TSHRLMNAMEN1
Butyl Alcohol SCHEMBL18281525 1.00 ALDH1A1 (0.92) ALDH1A1SMN1; SMN2TSHRLMNAMEN1
Butyl Alcohol SCHEMBL10349177 0.96 ALDH1A1 (0.85) ALDH1A1SMN1; SMN2TSHRLMNAMEN1
Butyl Alcohol SCHEMBL8511786 0.96 ALDH1A1 (0.85) ALDH1A1SMN1; SMN2TSHRLMNAMEN1
Butyl Alcohol SCHEMBL10883422 0.96
Butyl Alcohol SCHEMBL10348859 0.96 ALDH1A1 (0.85) ALDH1A1SMN1; SMN2TSHRLMNAMEN1
Butyl Alcohol SCHEMBL29196222 0.96 ALDH1A1 (0.85) ALDH1A1SMN1; SMN2TSHRLMNAMEN1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 10 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-119045280-A Negative photosensitive resin composition, method for producing cured relief pattern, and semiconductor device 武汉柔显科技股份有限公司 2024-11-29 CN disclosed
CN-113820920-B Photosensitive resin composition, method for producing cured relief pattern, and semiconductor device 旭化成株式会社 2023-07-04 CN disclosed
CN-116113884-A Method for producing cured product, method for producing laminate, and method for producing electronic device 富士胶片株式会社 2023-05-12 CN disclosed
CN-115867866-A Method for producing cured product, resin composition, developer, method for producing laminate, and method for producing semiconductor device 富士胶片株式会社 2023-03-28 CN disclosed
CN-115755526-A Photosensitive resin composition and method for producing cured relief pattern 旭化成株式会社 2023-03-07 CN disclosed
CN-115729037-A Cured product, laminate, semiconductor device, method for producing same, resin composition, and compound 富士胶片株式会社 2023-03-03 CN disclosed
CN-115298040-A Cylindrical printing plate and method for manufacturing printed matter 东丽株式会社 2022-11-04 CN disclosed
CN-115185157-A Photosensitive resin composition, method for producing cured relief pattern, and semiconductor device 旭化成株式会社 2022-10-14 CN disclosed
CN-113820920-A Photosensitive resin composition, method for producing cured relief pattern, and semiconductor device 旭化成株式会社 2021-12-21 CN disclosed
CN-107850844-B Photosensitive resin composition, method for producing cured relief pattern, and semiconductor device 旭化成株式会社 2021-09-07 CN disclosed