SCHEMBL28638485

SCHEMBL28638485

CCO[Si](CCCOC(=O)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)F)(OCC)OCC

nearest known ligand 0.40

Predicted protein targets (top 7)

geneUniProtsupporting neighboursconfidence
CA1 P00915 3/20 0.40
CA2 P00918 3/20 0.40
THRB P10828 1/20 0.33
KDM4E B2RXH2 1/20 0.32
POLB P06746 1/20 0.32
MAPT P10636 1/20 0.32
KMT2A Q03164 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL17192468 1.00 CA1 (0.40) CA1CA2THRBKDM4EPOLB
SCHEMBL17192457 0.94 CA1 (0.38) CA1CA2THRBKDM4EPOLB
SCHEMBL17192469 0.94 CA1 (0.38) CA1CA2THRBKDM4EPOLB
SCHEMBL30096477 0.85 CA1 (0.41) CA1CA2THRB
SCHEMBL28651751 0.85 CA1 (0.41) CA1CA2THRB
SCHEMBL9804438 0.84 CA1 (0.39) CA1CA2THRB
SCHEMBL1802610 0.82 CES2 (0.32)
SCHEMBL11782527 0.80 CA1 (0.46) CA1CA2THRB
SCHEMBL9017970 0.80 CA1 (0.46) CA1CA2THRB
SCHEMBL9464351 0.80 CA1 (0.46) CA1CA2THRB

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-110114421-B Water-repellent coating composition and water-repellent coated substrate coated with the same 株式会社东进世美肯 2022-06-10 CN claimed
CN-114867794-A Water-repellent coating composition for wet coating comprising silsesquioxane oligomer 株式会社东进世美肯 2022-08-05 CN disclosed
CN-110114421-B Water-repellent coating composition and water-repellent coated substrate coated with the same 株式会社东进世美肯 2022-06-10 CN disclosed
CN-113260686-A Synthetic resin coating composition and method for producing synthetic resin substrate using same 株式会社东进世美肯 2021-08-13 CN disclosed