⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL2867904 | 0.81 | — | — | |
| SCHEMBL3457818 | 0.80 | — | — | |
| SCHEMBL2863654 | 0.78 | — | — | |
| SCHEMBL2947849 | 0.74 | — | — | |
| Hydrochloric Acid SCHEMBL3283252 | 0.72 | — | — | |
| SCHEMBL17812122 | 0.71 | — | — | |
| SCHEMBL12932567 | 0.71 | — | — | |
| SCHEMBL17835225 | 0.71 | — | — | |
| SCHEMBL1898393 | 0.71 | CYP1A2 (0.31) | — | |
| SCHEMBL1903914 | 0.71 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 96 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-12624265-B2 | Antistatic agent, antistatic composition comprising same, antistatic resin composition comprising same, and molded article thereof | ADEKA CORPORATION (JP) | 2026-05-12 | — | — | US | disclosed |
| US-20260022204-A1 | ANTISTATIC AGENT, ANTISTATIC AGENT COMPOSITION CONTAINING SAME, ANTISTATIC RESIN COMPOSITION CONTAINING SAID ANTISTATIC AGENT OR SAID ANTISTATIC AGENT COMPOSITION, AND MOLDED BODY AND FILM THEREOF | ADEKA CORPORATION (JP) | 2026-01-22 | — | — | US | disclosed |
| US-12466956-B2 | Electroconductive resin composition and molded article of same | DENKA COMPANY LIMITED (JP) | 2025-11-11 | — | — | US | disclosed |
| EP-4582507-A1 | ANTISTATIC AGENT, ANTISTATIC AGENT COMPOSITION CONTAINING SAME, ANTISTATIC RESIN COMPOSITION CONTAINING SAID ANTISTATIC AGENT OR SAID ANTISTATIC AGENT COMPOSITION, AND MOLDED BODY AND FILM THEREOF | ADEKA CORPORATION (JP) | 2025-07-09 | — | — | EP | disclosed |
| US-20250163281-A1 | THERMOPLASTIC RESIN COMPOSITION FOR FUSED DEPOSITION MODELING, MODELED BODY, AND METHOD FOR PRODUCING SAME | ADEKA CORPORATION (JP) | 2025-05-22 | — | — | US | disclosed |
| EP-4484465-A1 | THERMOPLASTIC RESIN COMPOSITION FOR FUSED DEPOSITION MODELING, MODELED BODY, AND METHOD FOR PRODUCING SAME | ADEKA CORPORATION (JP) | 2025-01-01 | — | — | EP | disclosed |
| CN-118749016-A | Thermoplastic resin composition for hot melt lamination molding, molded body, and method for producing the same | 株式会社ADEKA | 2024-10-08 | — | — | CN | disclosed |
| WO-2024048524-A1 | ANTISTATIC AGENT, ANTISTATIC AGENT COMPOSITION CONTAINING SAME, ANTISTATIC RESIN COMPOSITION CONTAINING SAID ANTISTATIC AGENT OR SAID ANTISTATIC AGENT COMPOSITION, AND MOLDED BODY AND FILM THEREOF | 株式会社ADEKA | 2024-03-07 | — | — | WO | disclosed |
| WO-2023189133-A1 | CONDUCTIVE RESIN COMPOSITION | デンカ株式会社 | 2023-10-05 | — | — | WO | disclosed |
| WO-2023163017-A1 | THERMOPLASTIC RESIN COMPOSITION FOR FUSED DEPOSITION MODELING, MODELED BODY, AND METHOD FOR PRODUCING SAME | 株式会社ADEKA | 2023-08-31 | — | — | WO | disclosed |
| US-7470738-B2 | Non-aqueous absorbent and use thereof | SANYO CHEMICAL INDUSTRIES, LTD. (JP) | 2008-12-30 | — | — | US | disclosed |
| US-20080094777-A1 | Electric double layer capacitor | SUMITOMO CHEMICAL COMPANY, LIMITED (JP) | 2008-04-24 | — | — | US | disclosed |
| EP-1905740-A1 | ELECTRIC DOUBLE LAYER CAPACITOR | Sumitomo Chemical Company, Limited (JP) | 2008-04-02 | — | — | EP | disclosed |
| EP-1876611-A1 | ELECTRIC DOUBLE LAYER CAPACITOR | Sumitomo Chemical Company, Limited (JP) | 2008-01-09 | — | — | EP | disclosed |
| US-20070269987-A1 | Polishing Liquid for Cmp Process and Polishing Method | SANYO CHEMICAL INDUSTRIES, LTD. (JP) | 2007-11-22 | — | — | US | disclosed |
| CN-1302021-C | Non-aqueous absorbent and use thereof | SANYO CHEMICAL IND LTD (JP) | 2007-02-28 | — | — | CN | disclosed |
| EP-1628334-A1 | POLISHING LIQUID FOR CMP PROCESS AND POLISHING METHOD | SANYO CHEMICAL INDUSTRIES LTD. (JP) | 2006-02-22 | — | — | EP | disclosed |
| US-20050136247-A1 | Non-aqueous absorbent and use thereof | SANYO CHEMICAL INDUSTRIES, LTD. (JP) | 2005-06-23 | — | — | US | disclosed |
| CN-1610703-A | Non-aqueous absorbent and use thereof | SANYO CHEMICAL IND LTD (JP) | 2005-04-27 | — | — | CN | disclosed |
| EP-1462460-A1 | NON-AQUEOUS ABSORBENT AND USE THEREOF | SANYO CHEMICAL INDUSTRIES, LTD. (JP) | 2004-09-29 | — | — | EP | disclosed |