SCHEMBL2864347

SCHEMBL2864347

CCCCCCCCOC(=O)CCCCCS

nearest known ligand 0.71

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
DGKA P23743 1/20 0.71
DNM1 Q05193 1/20 0.64
NAAA Q02083 1/20 0.60
PRSS1 P07477 1/20 0.59
PRSS2 P07478 1/20 0.59
PRSS3 P35030 1/20 0.59
HTR2C P28335 1/20 0.57
PAM P19021 2/20 0.55
TSHR P16473 1/20 0.51
MAPT P10636 1/20 0.51
RAD52 P43351 1/20 0.51
NPSR1 Q6W5P4 1/20 0.51
FAAH O00519 1/20 0.50
ALDH1A1 P00352 1/20 0.50
LMNA P02545 1/20 0.50
EPHX2 P34913 1/20 0.49
KDM4E B2RXH2 1/20 0.49
DUSP3 P51452 1/20 0.49
MEN1 O00255 1/20 0.49
KMT2A Q03164 1/20 0.49

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL16145053 1.00 DGKA (0.71) DGKADNM1NAAAPRSS1PRSS2
SCHEMBL10961476 1.00 DGKA (0.71) DGKADNM1NAAAPRSS1PRSS2
SCHEMBL9420628 1.00 DGKA (0.71) DGKADNM1NAAAPRSS1PRSS2
SCHEMBL5804130 1.00 DGKA (0.71) DGKADNM1NAAAPRSS1PRSS2
SCHEMBL2864363 1.00 DGKA (0.71) DGKADNM1NAAAPRSS1PRSS2
SCHEMBL9420594 1.00 DGKA (0.71) DGKADNM1NAAAPRSS1PRSS2
SCHEMBL6547568 1.00 DGKA (0.71) DGKADNM1NAAAPRSS1PRSS2
SCHEMBL11404866 1.00 DGKA (0.71) DGKADNM1NAAAPRSS1PRSS2
SCHEMBL9420809 1.00 DGKA (0.71) DGKADNM1NAAAPRSS1PRSS2
SCHEMBL7002060 1.00 DGKA (0.71) DGKADNM1NAAAPRSS1PRSS2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-7767115-B2 Metal particle dispersion liquid, method for manufacturing metal particle dispersion liquid, method for manufacturing conductive-film-forming substrate, electronic device and electronic apparatus SEIKO EPSON CORPORATION (JP) 2010-08-03 US disclosed
US-20090250667-A1 Metal particle dispersion liquid, method for manufacturing metal particle dispersion liquid, method for manufacturing conductive-film-forming substrate, electronic device and electronic apparatus SEIKO EPSON CORPORATION (JP) 2009-10-08 US disclosed
US-7560051-B2 Metal particle dispersion liquid, method for manufacturing metal particle dispersion liquid, method for manufacturing conductive-film-forming substrate, electronic device and electronic apparatus SEIKO EPSON CORPORATION (JP) 2009-07-14 US disclosed
US-20060210815-A1 Metal particle dispersion liquid, method for manufacturing metal particle dispersion liquid, method for manufacturing conductive-film-forming substrate, electronic device and electronic apparatus SEIKO EPSON CORPORATION (JP) 2006-09-21 US disclosed