Predicted protein targets (top 15)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | DGKA | P23743 | 1/20 | 0.40 |
| ▸ | LMNA | P02545 | 3/20 | 0.38 |
| ▸ | ALDH1A1 | P00352 | 2/20 | 0.38 |
| ▸ | PAM | P19021 | 2/20 | 0.37 |
| ▸ | MAPT | P10636 | 2/20 | 0.36 |
| ▸ | MAPK1 | P28482 | 1/20 | 0.36 |
| ▸ | TSHR | P16473 | 1/20 | 0.35 |
| ▸ | CES2 | O00748 | 4/20 | 0.34 |
| ▸ | NAAA | Q02083 | 2/20 | 0.34 |
| ▸ | DNM1 | Q05193 | 1/20 | 0.34 |
| ▸ | CES1 | P23141 | 3/20 | 0.33 |
| ▸ | KDM4E | B2RXH2 | 1/20 | 0.33 |
| ▸ | DUSP3 | P51452 | 1/20 | 0.33 |
| ▸ | MEN1 | O00255 | 1/20 | 0.33 |
| ▸ | KMT2A | Q03164 | 1/20 | 0.33 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL20918329 | 0.89 | DGKA (0.52) | DGKALMNAALDH1A1PAMMAPT | |
| SCHEMBL25902079 | 0.89 | DGKA (0.52) | DGKALMNAALDH1A1PAMMAPT | |
| SCHEMBL9768582 | 0.89 | DGKA (0.52) | DGKALMNAALDH1A1PAMMAPT | |
| SCHEMBL9768580 | 0.89 | DGKA (0.52) | DGKALMNAALDH1A1PAMMAPT | |
| SCHEMBL5603689 | 0.87 | DGKA (0.37) | DGKALMNAALDH1A1PAMMAPT | |
| SCHEMBL28406124 | 0.87 | DGKA (0.48) | DGKALMNAALDH1A1PAMMAPT | |
| Water SCHEMBL28184192 | 0.86 | DGKA (0.36) | DGKALMNAALDH1A1PAMMAPT | |
| SCHEMBL29227001 | 0.85 | DGKA (0.52) | DGKALMNAALDH1A1PAMMAPT | |
| SCHEMBL28949803 | 0.85 | DGKA (0.52) | DGKALMNAALDH1A1PAMMAPT | |
| SCHEMBL8041219 | 0.85 | DGKA (0.52) | DGKALMNAALDH1A1PAMMAPT |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 7 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-119447056-A | Semiconductor package, method for manufacturing semiconductor package, and thermally conductive composition for use therein | 住友电木株式会社 | 2025-02-14 | — | — | CN | disclosed |
| CN-115195217-B | Transparent laminated board based on glued membrane | 卡里福热师私人有限公司 | 2024-07-30 | — | — | CN | disclosed |
| CN-116888189-A | Thermosetting resin composition, cured product, resin sheet, prepreg, metal foil-clad laminate, multilayer printed wiring board, sealing material, fiber-reinforced composite material, adhesive, and semiconductor device | 日本化药株式会社 | 2023-10-13 | — | — | CN | disclosed |
| CN-115304818-B | Ultralow-temperature thermal expansion microsphere prepared based on Pickering emulsion polymerization method and preparation method thereof | 上海化工研究院有限公司 | 2023-08-01 | — | — | CN | disclosed |
| CN-113632219-A | Thermally conductive composition and semiconductor device | 住友电木株式会社 | 2021-11-09 | — | — | CN | disclosed |
| CN-113631675-A | Semiconductor package, method for manufacturing semiconductor package, and thermally conductive composition used therefor | 住友电木株式会社 | 2021-11-09 | — | — | CN | disclosed |
| CN-112996839-A | Material for forming film for lithography, composition for forming film for lithography, underlayer film for lithography, and pattern formation method | 三菱瓦斯化学株式会社 | 2021-06-18 | — | — | CN | disclosed |