SCHEMBL2865197

SCHEMBL2865197

Nc1cccc(CCO[SiH3])c1

nearest known ligand 0.59

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
MAOB P27338 3/20 0.59
MAOA P21397 2/20 0.59
CYP19A1 P11511 1/20 0.57
CYP3A4 P08684 3/20 0.42
CASP1 P29466 1/20 0.42
RECQL P46063 1/20 0.42
SIGMAR1 Q99720 2/20 0.41
MAPT P10636 2/20 0.40
RAB9A P51151 2/20 0.39
NPC1 O15118 1/20 0.39
LMNA P02545 1/20 0.39
HTT P42858 1/20 0.39
SMN1; SMN2 Q16637 1/20 0.39
CYP11B1 P15538 1/20 0.38
CYP11B2 P19099 1/20 0.38
TP53 P04637 1/20 0.37
GRM2 Q14416 1/20 0.37
GRM3 Q14832 1/20 0.37
ALDH1A1 P00352 1/20 0.36
PARP1 P09874 1/20 0.36

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2154372 0.80 MAOB (0.86) MAOBMAOACYP19A1CYP3A4CASP1
SCHEMBL29436994 0.80 MAOB (0.86) MAOBMAOACYP19A1CYP3A4CASP1
SCHEMBL6678878 0.80 MAOB (0.59) MAOBMAOACYP19A1CYP3A4CASP1
SCHEMBL29684100 0.80 MAOB (0.59) MAOBMAOACYP19A1CYP3A4CASP1
SCHEMBL9401852 0.79 MAOB (0.52) MAOBMAOACYP19A1CYP3A4CASP1
SCHEMBL28027032 0.77 MAOB (0.65) MAOBMAOACYP19A1CYP3A4CASP1
SCHEMBL1026806 0.76 MAOB (0.71) MAOBMAOACYP19A1CYP3A4CASP1
SCHEMBL29437072 0.76 MAOB (0.71) MAOBMAOACYP19A1CYP3A4CASP1
SCHEMBL29436975 0.76 MAOB (0.71) MAOBMAOACYP19A1CYP3A4CASP1
SCHEMBL3482674 0.76 CYP19A1 (0.91) MAOBMAOACYP19A1CYP3A4CASP1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 28 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-12109812-B2 Ink jet printing method and ink jet printing apparatus SEIKO EPSON CORPORATION (JP) 2024-10-08 US disclosed
CN-114055975-B Ink jet recording method and ink jet recording apparatus 精工爱普生株式会社 2023-05-12 CN disclosed
CN-114055975-A Ink jet recording method and ink jet recording apparatus 精工爱普生株式会社 2022-02-18 CN disclosed
US-20220032618-A1 Ink Jet Printing Method And Ink Jet Printing Apparatus SEIKO EPSON CORPORATION (JP) 2022-02-03 US disclosed
US-10259208-B2 Three-dimensional shaped object manufacturing device, method for manufacturing three-dimensional shaped object, and three-dimensional shaped object SEIKO EPSON CORPORATION (JP) 2019-04-16 US disclosed
US-9579852-B2 Method for manufacturing three-dimensional shaped object SEIKO EPSON CORPORATION (JP) 2017-02-28 US disclosed
US-20160339602-A1 METHOD OF MANUFACTURING THREE-DIMENSIONAL STRUCTURE, THREE-DIMENSIONAL STRUCTURE MANUFACTURING APPARATUS, AND THREE-DIMENSIONAL STRUCTURE SEIKO EPSON CORPORATION (JP) 2016-11-24 US disclosed
US-20160263829-A1 THREE-DIMENSIONAL MODELING APPARATUS, MANUFACTURING METHOD, AND COMPUTER PROGRAM SEIKO EPSON CORPORATION (JP) 2016-09-15 US disclosed
US-9415545-B2 Method of manufacturing three-dimensional shaped object SEIKO EPSON CORPORATION (JP) 2016-08-16 US disclosed
US-20160107385-A1 THREE-DIMENSIONAL SHAPED OBJECT MANUFACTURING METHOD AND THREE-DIMENSIONAL SHAPED OBJECT SEIKO EPSON CORPORATION (JP) 2016-04-21 US disclosed
US-8322033-B2 Method for forming a conductive post for a multilayered wiring substrate SEIKO EPSON CORPORATION (JP) 2012-12-04 US disclosed
US-7776397-B2 Process for producing chemical adsorption film and chemical adsorption film SEIKO EPSON CORPORATION (JP) 2010-08-17 US disclosed
US-20090077798-A1 METHOD FOR FORMING CONDUCTIVE POST, METHOD FOR MANUFACTURING MULTILAYERED WIRING SUBSTRATE, AND METHOD FOR MANUFACTURING ELECTRONIC APPARATUS SEIKO EPSON CORPORATION (JP) 2009-03-26 US disclosed
US-20090071706-A1 METHOD FOR PRODUCING MULTILAYERED WIRING SUBSTRATE, MULTILAYERED WIRING SUBSTRATE, AND ELECTRONIC APPARATUS SEIKO EPSON CORPORATION (JP) 2009-03-19 US disclosed
US-7500895-B2 Patterned substrate, electro-optical device, and method for manufacturing an electro-optical device SEIKO EPSON CORPORATION (JP) 2009-03-10 US disclosed
US-20080317943-A1 METHOD FOR FORMING PATTERN, METHOD FOR MANUFACTURING ELECTRO-OPTICAL DEVICE, AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE SEIKO EPSON CORPORATION (JP) 2008-12-25 US disclosed
US-20080311285-A1 CONTACT HOLE FORMING METHOD, CONDUCTING POST FORMING METHOD, WIRING PATTERN FORMING METHOD, MULTILAYERED WIRING SUBSTRATE PRODUCING METHOD, ELECTRO-OPTICAL DEVICE PRODUCING METHOD, AND ELECTRONIC APPARATUS PRODUCING METHOD SEIKO EPSON CORPORATION (JP) 2008-12-18 US disclosed
US-20060127563-A1 Patterned substrate, electro-optical device, and method for manufacturing an electro-optical device SEIKO EPSON CORPORATION (JP) 2006-06-15 US disclosed
US-20060019034-A1 Process for producing chemical adsorption film and chemical adsorption film SEIKO EPSON CORPORATION (JP) 2006-01-26 US disclosed
US-20050287392-A1 Organic electroluminescent device, method for producing the same, and electronic apparatus SEIKO EPSON CORPORATION (JP) 2005-12-29 US disclosed