SCHEMBL28664879

SCHEMBL28664879

C=C[SiH](C=C)OOC(C)(C)C

nearest known ligand 0.37

Predicted protein targets (top 2)

geneUniProtsupporting neighboursconfidence
TSHR P16473 1/20 0.37
TDP1 Q9NUW8 1/20 0.37

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL27773861 0.71 TSHR (0.50) TSHRTDP1
SCHEMBL27905415 0.71
SCHEMBL28653974 0.67 TSHR (0.38) TSHRTDP1
SCHEMBL28537707 0.67 TSHR (0.32) TSHRTDP1
SCHEMBL5576981 0.65 TSHR (0.50) TSHRTDP1
Propene SCHEMBL2080326 0.65 TDP1 (0.61) TSHRTDP1
SCHEMBL11301235 0.64
SCHEMBL6995065 0.63
SCHEMBL14451076 0.61
Ethylene SCHEMBL30978350 0.60 TSHR (0.80) TSHRTDP1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-108070261-B Heat-curable silicon-oxygen composition, die-bonding material, and optical semiconductor device 信越化学工业株式会社 2021-06-18 CN disclosed