SCHEMBL2867264

SCHEMBL2867264

C=C(C(=O)O)C(C1CCCCCCCCC1)C1CCCCCCCCC1

nearest known ligand 0.52

Predicted protein targets (top 19)

geneUniProtsupporting neighboursconfidence
EPHX1 P07099 7/20 0.52
ALDH1A1 P00352 2/20 0.38
NPC1 O15118 2/20 0.34
RAB9A P51151 2/20 0.34
SMN1; SMN2 Q16637 2/20 0.34
MAPT P10636 1/20 0.34
KDM4E B2RXH2 1/20 0.34
CYP3A4 P08684 1/20 0.34
EPHX2 P34913 1/20 0.34
SHBG P04278 1/20 0.34
CES2 O00748 1/20 0.33
CES1 P23141 1/20 0.33
DPP4 P27487 2/20 0.33
CA12 O43570 2/20 0.32
CA1 P00915 2/20 0.32
CA2 P00918 2/20 0.32
MMP2 P08253 2/20 0.32
CA9 Q16790 2/20 0.32
TP53 P04637 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL479250 1.00 EPHX1 (0.52) EPHX1ALDH1A1NPC1RAB9ASMN1; SMN2
SCHEMBL14916107 1.00 EPHX1 (0.52) EPHX1ALDH1A1NPC1RAB9ASMN1; SMN2
SCHEMBL43523 0.98 EPHX1 (0.48) EPHX1ALDH1A1NPC1RAB9ASMN1; SMN2
Methacrylic Acid SCHEMBL1224497 0.90 EPHX1 (0.42) EPHX1ALDH1A1SHBGCA12CA1
SCHEMBL6824087 0.80 EPHX1 (0.40) EPHX1ALDH1A1NPC1RAB9ASMN1; SMN2
SCHEMBL1088361 0.78 EPHX1 (0.39) EPHX1ALDH1A1NPC1RAB9ASMN1; SMN2
SCHEMBL6743657 0.78 EPHX1 (0.39) EPHX1ALDH1A1NPC1RAB9ASMN1; SMN2
SCHEMBL165974 0.78 EPHX1 (0.39) EPHX1ALDH1A1NPC1RAB9ASMN1; SMN2
SCHEMBL165233 0.76 EPHX1 (0.35) EPHX1ALDH1A1SMN1; SMN2DPP4TP53
SCHEMBL28583502 0.76 EPHX1 (0.35) EPHX1ALDH1A1SMN1; SMN2KDM4ESHBG

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 13 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-10385268-B2 Photosensitive resin composition and display device SAMSUNG DISPLAY CO., LTD. (KR) 2019-08-20 US disclosed
US-9637683-B2 Photosensitive resin composition and display device SAMSUNG DISPLAY CO., LTD. (KR) 2017-05-02 US disclosed
EP-2551123-B1 Printing method, printed material and molded article SEIKO EPSON CORP (JP) 2016-08-17 EP disclosed
US-20160215212-A1 PHOTOSENSITIVE RESIN COMPOSITION AND DISPLAY DEVICE SAMSUNG DISPLAY CO., LTD. (KR) 2016-07-28 US disclosed
US-20160215213-A1 PHOTOSENSITIVE RESIN COMPOSITION AND DISPLAY DEVICE SAMSUNG DISPLAY CO., LTD. (KR) 2016-07-28 US disclosed
US-9242498-B2 Printing method, printing device, printed material and molded article SEIKO EPSON CORPORATION (JP) 2016-01-26 US disclosed
US-20150353751-A1 INKJET INK COMPOSITION, INKJET RECORDING METHOD, PRINTED MATERIAL, AND PROCESS FOR PRODUCING MOLDED PRINTED MATERIAL FUJIFILM CORPORATION (JP) 2015-12-10 US disclosed
US-8927094-B2 Printed article and method of manufacturing printed article SEIKO EPSON CORPORATION (JP) 2015-01-06 US disclosed
US-7713462-B2 Ink composition, inkjet recording method, printed material, and process for producing molded printed material FUJIFILM CORPORATION (JP) 2010-05-11 US disclosed
US-20090244116-A1 INKJET RECORDING METHOD AND INKJET RECORDING SYSTEM FUJIFILM CORPORATION (JP) 2009-10-01 US disclosed
US-20090214797-A1 INKJET INK COMPOSITION, AND INKJET RECORDING METHOD AND PRINTED MATERIAL EMPLOYING SAME FUJIFILM CORPORATION (JP) 2009-08-27 US disclosed
US-20090087626-A1 INK COMPOSITION, INKJET RECORDING METHOD, PRINTED MATERIAL, AND PROCESS FOR PRODUCING MOLDED PRINTED MATERIAL FUJIFILM CORPORATION (JP) 2009-04-02 US disclosed
US-20090087627-A1 WHITE INK COMPOSITION, INKJET RECORDING METHOD, AND PRINTED MATERIAL FUJIFILM CORPORATION (JP) 2009-04-02 US disclosed