⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL3974410 | 0.82 | — | — | |
| SCHEMBL9049912 | 0.82 | — | — | |
| SCHEMBL27559658 | 0.82 | — | — | |
| SCHEMBL862074 | 0.82 | — | — | |
| SCHEMBL4882286 | 0.82 | — | — | |
| SCHEMBL3833468 | 0.82 | — | — | |
| SCHEMBL27677 | 0.82 | — | — | |
| SCHEMBL975444 | 0.67 | — | — | |
| SCHEMBL3264089 | 0.67 | — | — | |
| Water SCHEMBL12987711 | 0.67 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 37 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-117917194-A | Ultra-thin copper foil with carrier foil for allowing simple micro-hole processing, copper-clad laminate using the same, and method for manufacturing the same | 乐天能源材料公司 | 2024-04-19 | — | — | CN | disclosed |
| CN-110301040-B | Ultra-thin copper foil with carrier foil | 乐天能源材料公司 | 2023-10-03 | — | — | CN | disclosed |
| CN-110402193-A | Extra thin copper foil with carrier foils | ILJIN MAT CO LTD | 2019-11-01 | — | — | CN | disclosed |
| CN-110382224-A | Extra thin copper foil with carrier foils | 日进材料股份有限公司 | 2019-10-25 | — | — | CN | disclosed |
| CN-110301040-A | Extra thin copper foil with carrier foils | 日进材料股份有限公司 | 2019-10-01 | — | — | CN | disclosed |
| CN-106460212-B | Copper foil with carrier, the manufacturing method of the copper foil with carrier, the copper clad laminate obtained with the copper foil and printed wiring board | 三井金属矿业株式会社 | 2019-05-14 | — | — | CN | disclosed |
| CN-106460212-A | Copper foil with carrier, manufacturing method for copper foil with carrier, copper clad laminate sheet and printed wiring board obtained using copper foil with carrier | 三井金属矿业株式会社 | 2017-02-22 | — | — | CN | disclosed |
| EP-1420621-B1 | Ultra-thin copper foil with carrier, method of production of same, and printed circuit board using ultra-thin copper foil with carrier | FURUKAWA ELECTRIC CO LTD (JP) | 2014-08-13 | — | — | EP | disclosed |
| US-20130220679-A1 | COPPER FOIL AND MANUFACTURING METHOD THEREFOR, COPPER FOIL WITH CARRIER AND MANUFACTURING METHOD THEREFOR, PRINTED CIRCUIT BOARD, AND MULTILAYER PRINTED CIRCUIT BOARD | FURUKAWA ELECTRIC CO., LTD. (JP) | 2013-08-29 | — | — | US | disclosed |
| EP-2615196-A1 | COPPER FOIL AND MANUFACTURING METHOD THEREFOR, COPPER FOIL WITH CARRIER AND MANUFACTURING METHOD THEREFOR, PRINTED CIRCUIT BOARD, AND MULTILAYER PRINTED CIRCUIT BOARD | Furukawa Electric Co., Ltd. (JP) | 2013-07-17 | — | — | EP | disclosed |
| CN-1599513-A | Ultra-thin copper foil with carrier, method for producing the same, and wiring board | FURUKAWA CIRCUIT FOIL (JP) | 2005-03-23 | — | — | CN | disclosed |
| US-20050048306-A1 | Method of producing ultra-thin copper foil with carrier, ultra-thin copper foil with carrier produced by the same, printed circuit board, multilayer printed circuit board and chip on film circuit board | THE FURUKAWA ELECTRIC CO., LTD. (JP) | 2005-03-03 | — | — | US | disclosed |
| EP-1511366-A2 | Method of producing ultra-thin copper foil with carrier, ultra-thin copper foil with carrier produced by the same, printed circuit board, multilayer printed circuit board and chip on film circuit board | FURUKAWA CIRCUIT FOIL CO., LTD. (JP) | 2005-03-02 | — | — | EP | disclosed |
| US-20040121178-A1 | Ultra-thin copper foil with carrier, method of production of same, and printed circuit board using ultra-thin copper foil with carrier | THE FURUKAWA ELECTRIC CO., LTD. (JP) | 2004-06-24 | — | — | US | disclosed |
| CN-1498749-A | Super-thin copper foil with carrier, its mfg. method and printed wiring base plate | �źӵ�·ͭ����ʽ���� | 2004-05-26 | — | — | CN | disclosed |
| EP-1420621-A1 | Ultra-thin copper foil with carrier, method of production of same, and printed circuit board using ultra-thin copper foil with carrier | FURUKAWA CIRCUIT FOIL CO., LTD. (JP) | 2004-05-19 | — | — | EP | disclosed |
| US-20040038049-A1 | Release layer, a diffusion preventive layer and a copper electroplating layer; printed circuits | CIRCUIT FOIL JAPAN CO., LTD. (JP) | 2004-02-26 | — | — | US | disclosed |
| CN-1466517-A | Copper foil for high-density ultrafine wiring board | �źӵ�·ͭ����ʽ���� | 2004-01-07 | — | — | CN | disclosed |
| EP-1331088-A1 | COPPER FOIL FOR HIGH-DENSITY ULTRAFINE WIRING BOARD | Circuit Foil Japan Co. Ltd (JP) | 2003-07-30 | — | — | EP | disclosed |
| US-5464670-A | Rare earth metal powder; miniature electronics | SEIKO EPSON CORPORATION (JP) | 1995-11-07 | — | — | US | disclosed |