SCHEMBL2869999

SCHEMBL2869999

O=S(=O)(S)OS

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2343521 0.70
SCHEMBL23671462 0.70
SCHEMBL1052333 0.67
SCHEMBL15290683 0.67
SCHEMBL7745619 0.67
SCHEMBL179013 0.67
SCHEMBL11591909 0.67
SCHEMBL724833 0.67
SCHEMBL3211061 0.67
SCHEMBL793593 0.65

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 21 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-12559853-B2 Differential contrast plating for advanced packaging applications LAM RESEARCH CORPORATION (US) 2026-02-24 US claimed
CN-114514340-B Differential contrast plating for advanced packaging applications 朗姆研究公司 2025-03-21 CN claimed
US-20220275531-A1 DIFFERENTIAL CONTRAST PLATING FOR ADVANCED PACKAGING APPLICATIONS LAM RESEARCH CORPORATION (US) 2022-09-01 US claimed
CN-114514340-A Differential contrast plating for advanced packaging applications 朗姆研究公司 2022-05-17 CN claimed
US-20060210823-A1 Low surface roughness electrolytic copper foil and process for producing the same FUKUDA METAL FOIL & POWDER CO., LTD. (JP) 2006-09-21 US claimed
US-12559853-B2 Differential contrast plating for advanced packaging applications LAM RESEARCH CORPORATION (US) 2026-02-24 US disclosed
CN-114514340-B Differential contrast plating for advanced packaging applications 朗姆研究公司 2025-03-21 CN disclosed
US-20220275531-A1 DIFFERENTIAL CONTRAST PLATING FOR ADVANCED PACKAGING APPLICATIONS LAM RESEARCH CORPORATION (US) 2022-09-01 US disclosed
CN-114514340-A Differential contrast plating for advanced packaging applications 朗姆研究公司 2022-05-17 CN disclosed
CN-112526032-B Method for detecting policresulen 北京金城泰尔制药有限公司 2022-05-17 CN disclosed
CN-110756170-B Preparation method of expanded perlite sulfur-carrying modified patina adsorbent 常熟理工学院 2021-10-29 CN disclosed
CN-112526032-A Method for detecting policresulen 北京金城泰尔制药有限公司 2021-03-19 CN disclosed
US-9343095-B2 Head gimbals assembly, method for manufacturing thermal-assisted magnetic recording and manufacturing equipment of thermal-assisted magnetic recording HGST Netherlands B.V. (NL) 2016-05-17 US disclosed
CN-102531981-A Improved method for sulfhydrylation reaction in synthesis process of 2,3-sodium dimercaptosulphonate Hefei lifang pharmaceutical co ltd 2012-07-04 CN disclosed
CN-102531981-A Improved method for sulfhydrylation reaction in synthesis process of 2,3-sodium dimercaptosulphonate Hefei lifang pharmaceutical co ltd 2012-07-04 CN disclosed
US-7789976-B2 Electrodeposited copper foil with low surface roughness having a low lowering rate of a tensile strength with time or accompanied with heat treatment, and having an excellent elongation rate at a high temperature FUKUDA METAL FOIL & POWDER CO., LTD. (JP) 2010-09-07 US disclosed
US-20060210823-A1 Low surface roughness electrolytic copper foil and process for producing the same FUKUDA METAL FOIL & POWDER CO., LTD. (JP) 2006-09-21 US disclosed
US-20040077779-A1 Aqueous coating compositions SURFACE SPECIALTIES GERMANY GMBH & CO. KG 2004-04-22 US disclosed
US-6429254-B2 Aqueous polyurethane dispersions containing polybutadiene units SOLUTIA AUSTRIA GMBH (AT) 2002-08-06 US disclosed
US-20020010259-A1 Aqueous polyurethane dispersions containing polybutadiene units SOLUTIA SYSTEMS, INC. 2002-01-24 US disclosed